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NEWS TAGGED SEMICONDUCTOR EQUIPMENT
Wednesday 13 October 2021
Tian Zheng enters into semiconductor applications, expects equipment shipments to double in 2022
Tian Zheng International Precision Machinery (TZI), which has a high market share in sorting, packaging and testing equipment for passive components, has seen strong order momentum...
Thursday 23 September 2021
Semiconductor equipment billings drop in August
August billings among North American manufacturers of semiconductor production equipment decreased 5.4%, bringing an end to an eight-month period of consecutive increases.
Wednesday 15 September 2021
Global fab equipment spending to hit another record high in 2022, says SEMI
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion...
Wednesday 8 September 2021
Semi equipment billings hit record high in 2Q21, says SEMI
Global semiconductor equipment billings increased 48% on year and 5% sequentially to a record high of US$24.9 billion in the second quarter of 2021, according to SEMI.
Tuesday 24 August 2021
Semiconductor equipment billings rise again
North America-based semiconductor equipment manufacturers posted US$3.86 billion in billings worldwide in July 2021 (three-month average basis), a record high for the seventh consecutive...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Wednesday 28 July 2021
Semiconductor equipment billings reach record high for 6th consecutive month
North America-based semiconductor equipment manufacturers posted US$3.67 billion in billings worldwide in June 2021 (three-month average basis), a record high for the sixth consecutive...
Wednesday 28 July 2021
TSMC on track for bold overseas manufacturing deployments
Following its move to set up a 5nm chips fabrication plant in the US and expand foundry capacity in China, TSMC has recently confirmed its intentions to build fabs in Japan and Germany...
Wednesday 30 June 2021
Compound semiconductors now national strategic materials, says GlobalWafers chair
Compound semiconductors will become a key industry sector reaching a national strategic level in importance, as they will be badly needed to power many critical technological applications...
Friday 25 June 2021
Hiwin breaks ground for plant in Japan
Mechanical motion control component maker Hiwin Technologies has announced it has broken ground for its new plant in Japan's Kobe as scheduled despite the lingering coronavirus pandemic...
Tuesday 22 June 2021
Semiconductor equipment billings hit another record high
North America-based manufacturers of semiconductor equipment posted US$3.59 billion in billings worldwide in May 2021 (three-month average basis), logging a record high for the fifth...
Friday 18 June 2021
Applied Materials breakthrough in chip wiring enables logic scaling to 3nm and beyond
Applied Materials has unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
Tuesday 8 June 2021
Foxsemicon sees COVID cluster infections
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Technology Group, has announced suspension of its fab operations in Taiwan for two days...
Tuesday 25 May 2021
Semiconductor equipment billings rise again
Billings among North American manufacturers of semiconductor production equipment topped US$3 billion for the fourth consecutive month in April 2021, which also marked the fifth consecutive...
Monday 17 May 2021
Semiconductor equipment supplier Trusval enjoys robust orders
Trusval Technology has disclosed that customer orders it holds on hand are already at record-high levels, buoyed by robust demand from its chipmaking customers looking to spend more...