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Thursday 21 April 2022
ASE to complete Chungli factory site expansion in 3Q24
ASE Technology is scheduled to complete constructing additional production lines and facilities at its manufacturing site in Chungli, northern Taiwan in the third quarter of 2024,...
Friday 25 March 2022
Advanced packaging technology outlook, 2020-2026
Flip chip (FC) and system-in-package (SiP) assembly remain the mainstream chip packaging technologies, while fan-out (FO) FO packaging was adopted for smartphone APs starting 2017...
Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Wednesday 23 February 2022
Unimicron to merge with SiP substrate specialist
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Wednesday 23 February 2022
ASE eyeing backend orders for Apple-designed 5G modem chips
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Friday 11 February 2022
ASE expects auto chip backend biz to hit over US$1 billion in 2022
Taiwan's leading OSAT ASE Technology expects revenues from backend services for automotive chips to break a landmark level of US$1 billion in 2022 after growing 60% on year in 2021...
Wednesday 5 January 2022
Micro-packaging demand for ESD chips to grow robustly
ESD (electrostatic discharge) protection components have become increasingly crucial peripheral chips for handset and metaverse devices, spurring great demand for micro-packaging...
Friday 10 December 2021
Taiwan IC substrate makers poised to enjoy strong 4Q21
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are all poised to see their revenues peak for 2021 in the fourth quarter thanks to strong shipments for fulfilling...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Wednesday 1 December 2021
Supply chain cooperation crucial to address SiP challenges, says ASE VP
Different types of SiP (system in package) solutions are facing diverse challenges, and can be materialized only through close cooperation among related semiconductor supply chain...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Friday 12 November 2021
Nan Ya PCB expects double-digit revenue growth in 2022
Taiwan-based Nan Ya PCB is optimistic that its 2022 revenues will register another double-digit growth on new ABF and BT production capacities gradually coming online.
Tuesday 9 November 2021
Na Ya posts record revenues for October on strong sales of electronics, chemical materials
Taiwan-based Nan Ya Plastics has reported its October revenues grew 4.9% sequentially and 51.4% on year reaching a record monthly high of NT$37.45 billion (US$1.343 billion).
Friday 29 October 2021
IC backend quotes to stay favorable to OSATs in 2022, says ASE
ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...
Thursday 28 October 2021
'SysMoore' or 'More than Moore': Semiconductor technologies likely to evolve with system complexity
The sustainability of Moore's Law, an observation made by Gordon Moore in 1965 that the number of transistors on a chip would double every 18 months, has been in the center of debate...
May 11, 09:31
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Monday 18 April 2022
iCatch and Prophesee collaborate on development of AI vision processor natively compatible with Prophesee Event-based Metavision sensing technologies
The memory industry (1): The era of DRAM driving semiconductor manufacturing process improvement
MacBook Pro shipments seriously delayed by China lockdowns
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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