The coronavirus epidemic has cast a shadow over MediaTek's competitiveness in the 5G SoC market this year, as China is the chipmaker's largest market, according to market observers...

Networking IC specialist Realtek Semiconductor remains positive about its performance in the first quarter of 2020, with no substantial shifts in customer orders so far despite the...

MediaTek is likely to post a revenue decline of as much as 15% sequentially in the first quarter of 2020, due mainly to a collapse in demand from China's handset market, according...

The global market for memory and processing semiconductors used in artificial intelligence (AI) applications will soar to US$128.9 billion in 2025, three times the US$42.8 billion...

Qualcomm and MediaTek are expected to each post a double-digit increase in mobile chip sales this year, with gross margin edging up single-digit percentage points thanks to the availability...

Market speculation is emerging that Qualcomm might lower quotes for midrange 5G chip solutions thanks to improved yield rates at foundry partner Samsung Electronics, but industry...

MediaTek is expected to see its gross margin improve further in the first quarter of 2020, thanks to the rollouts of its new chip solutions coupled with tight foundry capacities,...

The global supply of 5G mobile chips remains constrained, due to tight 7nm manufacturing process capacities at foundries, according to industry sources.

IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...

MediaTek has introduced its Dimensity 800 series, a new 7nm SoC designed for mid-range 5G smartphones slated for launch later in the first half of 2020.

MediaTek is set to unveil its second sub-6 GHz 5G SoC, codenamed Dimensity 800, at the upcoming CES 2020 and start delivering the chips in the second quarter of the year.

MediaTek is expected to embrace an ambitious strategy to grow its presence in the 5G smartphone SoC sector. It will focus its efforts on 5G chip solutions for the upper midrange smartphone...

While planning to unveil its second sub-6 GHz 5G chip on December 25, MediaTek is also eyeing to introduce its first mmWave 5G chip in the second half of 2020, according to sources...

Although demand for 5G smartphones is expected to pick up dramatically in 2020, prices of related SoC are expected to stay unfriendly for the first half of 2020 and are unlikely to...

Unit prices for 5G mobile SoCs may begin to ease off in the second half of 2020, according to industry sources.

Intel Labs has unveiled a cryogenic control chip, code-named "Horse Ridge," for speeding up development of full-stack quantum computing systems.

MediaTek reportedly plans to unveil its second 5G SoC in the latter half of December, one month after it released the first model of its 5G SoC family product, the Dimensity 1000,...

The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G...

Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are...

MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz, accelerating...

Demand for 5G smartphones is expected to pick up fast next year, with mobile SoC prices for these handsets to stay at high levels at least in the first half of 2020. Tight capacity...

Chip demand for true wireless stereo (TWS) earbuds and earphones is set to remain robust in 2020, according to industry sources in Taiwan.

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...