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NEWS TAGGED SOC
Thursday 29 July 2021
Taiwan supply chain gearing up shipments for new iPhones
TSMC and other Taiwan partners in the chips supply chain for iPhones are gearing up to start fulfilling initial orders for new iPhones slated for launch later this year including...
Tuesday 6 July 2021
AMICCOM announces sub-1GHz wireless transmitter SOC
AMICCOM releases new sub-1GHz wireless transmitter SoC, named A9339. A9339 integrates RF transmitter whose performance is the same as A7339. It can be used to communicate with AMICCOM's...
Monday 5 July 2021
Prices of 5G SoC solutions under downward pressure
The price spiral of 5G SoC solutions may come to an end soon due to the increasing availability of related chips, according to industry sources.
Wednesday 30 June 2021
Qualcomm make headway in 5G mmWave SoC solutions market
Qualcomm has made headway in the 5G mmWave solution market, securing related orders from many telecom operators and smartphone vendors in North America, Europe, Japan, Korea, India...
Wednesday 30 June 2021
Synopsys, Samsung Foundry extend partnership to 3nm GAA technology
Synopsys' Fusion Design Platform has enabled Samsung Foundry to achieve first-pass silicon success for an advanced, high-performance and multi-subsystem SoC, validating the extended...
Thursday 10 June 2021
Unimicron to sustain strong shipments of IC substrates, HDI boards
IC substrate and PCB supplier Unimicron Technology expects to sustain strong shipments throughout 2021, inspired by very clear order visibility for all its major product lines in...
Friday 4 June 2021
Texas Instruments remains top analog IC supplier
With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
Thursday 3 June 2021
New NXP automotive processors built using TSMC 16nm FinFET process
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Friday 21 May 2021
New Qualcomm 5G SoC built using TSMC 6nm process
Qualcomm's just-unveiled Snapdragon 778G chipset with integrated X52 5G modem is manufactured using TSMC's 6nm process technology, and is designed mainly for midrange 5G-capable Android...
Thursday 20 May 2021
SemiFive collaborates with Arm to accelerate custom SoC designs
SemiFive, a silicon design solutions provider, has joined the Arm ecosystem to accelerate the deployment of application-optimized custom SoC designs built on Arm technology. Through...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Monday 10 May 2021
MediaTek looking to use TSMC InFO_PoP for handset APs
MediaTek is developing new flagship handset SoCs with performance specs comparable to Apple's A series APs for iPhones, and may also adopt TSMC's advanced InFO_PoP packaging technology...
Friday 7 May 2021
Novatek, Himax set to post record 2Q21 revenues
Display driver IC specialists Novatek Microelectronics and Himax Technologies both expect to see their second-quarter revenues hit another record-high levels.