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NEWS TAGGED SPIL
Friday 12 August 2022
Uncertainty remains about iPhone demand between 4Q22 and 1Q23
Chipmakers have kicked off shipments for the upcoming iPhones slated for launch in September, but uncertainty remains whether the shipments will continue to see strong momentum between...
Wednesday 27 July 2022
OSATs slowing down mature packaging capacity expansion
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Friday 22 July 2022
Taiwan backend firms gearing up for next-gen HPC processors
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
Thursday 21 July 2022
SPIL and USI cut into supply chain for new wearables
Siliconware Precision Industries (SPIL) and Universal Scientific Industrial (USI), both under ASE Technology Holding, have cut into the supply chains for the upcoming Apple Watch...
Tuesday 19 July 2022
SPIL to build new plant in Taiwan
Siliconware Precision Industries (SPIL) under ASE Technology Holding plans to set up a new plant at the Central Taiwan Science Park (CTSP), with the plant's first-phase capacity slated...
Monday 27 June 2022
Taiwan IC test supply chain gaining from HPC chip boom
Taiwan's suppliers of high-end IC test interface solutions are poised to enjoy growing HPC chip demand for AI, datacenter and server applications, particularly now that Chinese chipmakers...
Tuesday 21 June 2022
Automotive MCU supply to stay tight through 2H23
The supply of automotive MCUs is expected to stay tight through the second half of 2023, according to industry sources.
Monday 20 June 2022
Taiwan backend partners gear up for new AMD, Nvidia HPC chips
Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...
Wednesday 15 June 2022
Top-3 game console vendors show mixed sales amid chip shortages
The world's three leading game console vendors Sony, Nintendo and Microsoft have shown mixed sales results amid the supply crunch of some basic chips and components.
Tuesday 7 June 2022
Top foundries, OSATs meet HPC boom with more advanced packaging solutions
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Friday 20 May 2022
IC test solutions providers see orders for HPC chips boom
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
Thursday 5 May 2022
Silicon Labs working closely with Taiwan foundries, OSATs
Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...