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NEWS TAGGED SPIL
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Thursday 20 May 2021
SPIL building new plant at CTSP as main high-end backend base
Siliconware Precision Industries (SPIL) is building a new plant at the Central Taiwan Science Park (CTSP), which will become its main high-end packaging and testing base for the next...
Thursday 6 May 2021
Suppliers to gear up for PS5 redesign
Suppliers including foundry TSMC are expected to kick off production for the redesign of Sony's PlayStation 5 (PS5) games console between the second and third quarters of 2022, according...
Monday 3 May 2021
Booming sales of AMD HPC chips to benefit IC distributors, testing firms
Some Taiwan-based IC distributors and testing service vendors in AMD's supply chain are benefiting significantly from robust sales of the US firm's HPC (high-performance computing)...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Wednesday 21 April 2021
Qualcomm, MediaTek mull fan-out packaging for flagship handset APs
Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...
Monday 12 April 2021
TSMC bold capex plan driving capacity expansions at ecosystem partners
TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry,...
Wednesday 31 March 2021
Prices for epoxy molding compounds to rise 10% in April
Prices for packaging-use epoxy molding compounds (EMC) will rise 10% starting April and supply shortages are expected to persist through the end of 2021 at least, according to Chang...
Monday 29 March 2021
SPIL to build NT$80 billion plant in central Taiwan
OSAT firm Siliconware Precision Industries (SPIL), wholly owned by ASE Technology, has secured 14.5 hectares of land in the Central Taiwan Science Park in Changhua County, where the...
Monday 8 March 2021
MediaTek may seek capacity support from China OSATs for lower-end chips
Taiwan's first-tier IC designers including MediaTek, now facing increasingly tight capacity support from domestic backend houses, are expected to release some orders to Chinese OSATs...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
Monday 22 February 2021
Qualcomm gearing up to cement capacity support from Taiwan partners
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
Friday 29 January 2021
Backend partners see clear order visibility for AMD chips till 3Q21
Backend houses including Taiwan's ASE Technology and China's Tongfu Microelectronics have seen the visibility of orders for packaging AMD's processors extended to mid third-quarter...