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NEWS TAGGED STMICROELECTRONICS
Wednesday 3 August 2022
Automotive IGBT lead times prolonged to 50 weeks
Delivery lead times for automotive-qualified IGBTs have been prolonged to 50 weeks or more, with the component shortage showing no sign of easing, according to industry sources in...
Monday 1 August 2022
Sumitomo Metal Mining to build 8-inch SiC substrate prototype line
Japan's Sumitomo Metal Mining (SMM) has decided to construct a new 8-inch direct bonded SiC wafer substrate mass-production prototype line, which will be completed for March 2024...
Friday 22 July 2022
Robust integrated GaN demand may prompt IDMs to step up outsourcing
IDMs have been promoting their integrated GaN chip solutions, and may step up outsourcing the production of such devices to satisfy growing demand, according to industry sources.
Tuesday 12 July 2022
ST, GF team up for 300mm wafer fab in France
STMicroelectronics and GlobalFoundries have signed a MoU to build a 300mm semiconductor manufacturing facility in France, according to the chipmakers.
Thursday 16 June 2022
Taiwan makers challenged in SiC applications for EV, industrial control
It has become an irreversible trend to incorporate third-generation semiconductor materials such as silicon carbide (SiC) into power devices and modules for electric vehicles (EV)...
Monday 13 June 2022
TI reportedly expects analog chip shortage to ease in 2H22
Texas Instruments (TI) has notified its clients that the supply-demand imbalance for analog chips, particularly power management ICs (PMICs), will ease in the second half of the year,...
Tuesday 17 May 2022
Actron, Eris eyeing IDM-like operations for car, industrial power devices
Taiwan-based power semiconductor suppliers including Actron Technology and Eris Technology are aggressively utilizing manufacturing and supply-chain resources from their affiliated...
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Thursday 5 May 2022
Autonomous vehicles to create massive AI business opportunities
The massive new nodes created inside and outside self-driving cars will bring new business opportunities for AI solutions, and the entire creation process can be seen as a combination...
Wednesday 27 April 2022
Pure-play foundries see automotive chip orders continue ramping up
Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.
Thursday 14 April 2022
Taiwan firms eyeing bigger presence in industrial MCU market
With IDMs such as Infineon and STMicroelectronics experiencing prolonged delivery lead times for industrial MCUs, Taiwan-based MCU suppliers are looking to fill the growing supply...
Wednesday 13 April 2022
Lead times for automotive and industrial MCUs from IDMs still long
Delivery lead times for automotive and industrial MCUs from international IDMs are still long reaching at least 30 weeks or even more than one year, while Taiwan makers are gearing...
Tuesday 22 March 2022
TSMC to see orders for auto chips ramp up
TSMC is expected to see orders for automotive electronics chips rise at a faster-than-expected pace, according to industry sources.
Thursday 10 March 2022
MCU, MOSFET makers gearing up for consumer GaN charger boom
With Apple reportedly designing its new 30W GaN charger with a new form factor, Taiwan-based MCU and power MOSFET suppliers are gearing up for a consumer GaN charger demand boom,...
Thursday 24 February 2022
Automotive MCU prices to rally further by 15-20% in 2Q22
Automotive MCU prices are expected to rise by another 15-20% in the second quarter of 2022 due to supply-side constraints, according to sources at related IC distributors.
Tuesday 5 December 2017
ST PWD13F60
STMicroelectronics' PWD13F60 system-in-package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board space in industrial motor drives, lamp ballasts, power supplies, converters, and inverters, according to the company. With a footprint 60% smaller than a comparable circuit built from discrete components, the PWD13F60 can also boost end-application power density, according to STMicro. By integrating four power MOSFETs, it presents an alternative to other modules on the market that are typically dual-FET half-bridge or six-FET three-phase devices. Unlike either of these choices, only one PWD13F60 is needed to implement a single-phase full bridge, leaving no internal MOSFETs unused. There is also flexibility to configure the module as one full bridge or two half bridges. Leveraging ST's high-voltage BCD6s-offline fabrication process, the PWD13F60 integrates gate drivers for the power MOSFETs and the bootstrap diodes needed for high-side driving, which simplifies board design and streamlines assembly by eliminating external components. The gate drivers are optimized for reliable switching and low EMI (electromagnetic interference). The SiP also features cross-conduction protection and under-voltage lockout, which helps further minimize footprint while ensuring system safety. The PWD13F60 supports a supply-voltage range extending down to 6.5V for maximum flexibility. In addition, the SiP inputs can accept logic signals from 3.3V to 15V to ensure interfacing with microcontrollers (MCUs), digital signal processors (DSPs), or Hall sensors.