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Tuesday 8 June 2021
Foxsemicon sees COVID cluster infections
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Technology Group, has announced suspension of its fab operations in Taiwan for two days...
Monday 17 May 2021
SK Hynix to expand 8-inch foundry capacity
SK Hynix is considering feasible plans to double its foundry capacity, according to company co-CEO and vice chairman Park Jung-ho.
Thursday 13 May 2021
AP Memory sees IoT RAM revenue surge
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has disclosed revenue generated from orders for IoT RAM products...
Wednesday 28 April 2021
PTI sees clear order visibility through 3Q21
Backend house Powertech Technology (PTI) and along with its logic IC packaging subsidiary Greatek Electronics have seen clear order visibility through the third quarter of 2021, with...
Tuesday 27 April 2021
Quanta new capacity in Taiwan to start production in 2Q21
Quanta Computer's newly expanded server capacity in Taiwan will begin volume production in the second quarter and raise the ODM's overall server output from Taiwan by 20%, according...
Tuesday 13 April 2021
TSMC reiterates commitment to US fab project
TSMC chairman Mark Liu, who participated in a virtual summit hosted by the Biden administration to discuss global chip shortages and the US plan to rebuild its semiconductor manufacturing...
Friday 9 April 2021
Nexperia, UAES agree partnership for gallium nitride
Nexperia has announced a comprehensive partnership covering gallium nitride (GaN) power semiconductor devices with United Automotive Electronic Systems (UAES). The program will focus...
Tuesday 6 April 2021
EV charging pile suppliers to benefit from US infrastructure project
Taiwan-based suppliers of charging piles see huge opportunities from the US government's latest US$2 trillion infrastructure expansion that includes the electric vehicle (EV) secto...
Monday 22 March 2021
TSMC to issue NT$21.1 billion in bonds
TSMC will issue a total of NT$21.1 billion (US$743.2 million) in unsecured bonds to finance new facility establishment and equipment purchases, according to a resolution approved...
Friday 19 March 2021
AP Memory develops versatile heterogeneous memory
AP Memory Technology, a subsidiary of Powerchip Technology specializing in customized memory chip designs and IPs, has developed a new heterogeneous integrated technology named VHM...
Thursday 11 March 2021
Unimicron to lease land for IC substrate capacity expansion
Taiwan's IC substrate maker Unimicron Technology has decided to lease a land lot in northern Taiwan to prepare for further capacity expansions beyond those already underway, expecting...
Wednesday 24 February 2021
Simplo subsidiary AES to go public in March
Simplo Technology's subsidiary AES that focuses on R&D of lithium backup battery unit (BBU) for datacenters and and electric vehicles (EV), will be listed on Taiwan Stock Exchange...
Thursday 18 February 2021
Packaging quotes for MCU and other consumer ICs set to rise
Packaging specialists, such as Greatek Electronics, plan to raise their quotes for MCU and other consumer IC products in the second quarter to reflect their tight capacities, according...
Thursday 18 February 2021
TSMC could set up fab in Europe
TSMC could set up an advanced wafer fab in Europe, where demand for leading-edge chip fabrication is promising, according to industry observers.
Wednesday 17 February 2021
TSMC to set up subsidiary in Japan for 3DIC material research
TSMC has unveiled plans to set up a wholly-owned subsidiary in Japan to expand its 3DIC material research, with a paid-in capital of up to JPY18.6 billion (US$186 million).