Pure-play foundries have seen order visibility for the third quarter of 2019 become blurred by the impact of the US trade ban on China's Huawei, according to industry sources.

TSMC has aleady started volume production of chips built using 7nm N7+ technology, the foundry's first process node with EUV lithography, according to the pure-play foundry.

TSMC continues fulfilling chip orders placed by Huawei and will maintain its supply to the China-based customer, according to the pure-play foundry, which also has reiterated its...

In efforts to mitigate impacts of US trade sanctions against Huawei and tariff hikes on Chinese imports, the China government has instructed domestic enterprises to purchase more...

With the US trade sanctions likely to prove disastrous to Huawei, Taiwan semiconductor supply chain partners can hardly give clear-cut prospects for the third quarter of 2019 and...

Unisoc's Ivy 510 5G modem chip has been validated for 5G NR sub-6 GHz signaling, and will be fabricated by TSMC on the 7nm node for official application in the starting year of 5G...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly grabbed orders for all the 5G modem chips that have been introduced by fabless chipmakers, such as Qualcomm's Snapdragon...

Pingtouge Semiconductor, Alibaba's semiconductor subsidiary, reportedly has placed orders for 7nm chip solutions with Global Unichip and TSMC.

Huawei's chipmaking arm HiSilicon is aggressively planning the development of its 5G mobile SoC integrating a modem chip, as well as 5G mmWave solutions for smartphones after releasing...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of US$3.98 billion for the purpose of upgrading...

TSMC has reported consolidated revenues of NT$74.69 billion (US$2.45 billion) for April 2019, down 6.3% sequentially and 8.8% on year.

Taiwan Semiconductor Manufacturing Company (TSMC) is on track to move 5nm process technology to volume production in 2020, and reportedly has plans...

Taiwan IC designers are now moving to place additional orders with foundry houses and thicken their inventories lest they should suffer insufficient foundry capacity support in the...

Samsung Electronics will be making significant efforts to strengthen the competitiveness of its logic IC business, and is also eyeing to become the world's largest logic chipmaker...

The semiconductor industry is expected to see demand pick up significantly in the second half of 2019 after gradually hitting the bottom, and Taiwan can compete well in the global...

Smartphone AP shipments to China slid 29.3% sequentially in first-quarter 2019 under the influence of system integrators' inventory adjustment and fewer working days.

IC backend house ASE Technology Holding and wafer probe card specialist Chunghwa Precision Test Tech (CHPT) are both engaged in the supply chain for HiSilicon's next-generation flagship...

Tsinghua Unigroup's chipmaking arm Unisoc has recently released a new generation chipset platform, Tiger 310 mobile SoC, for 4G smartphones, seeking to better cash in on pre-5G replacement...

TSMC has announced the expansion of its open innovation platform (OIP) cloud alliance, with Mentor Graphics joining inaugural members Amazon Web Services (AWS), Cadence, Microsoft...

TSMC has certified Ansys' solutions for its SoIC (system-on-integrated chips) 3D chip-stacking technology, according to Ansys, an engineering simulation software provider.

Despite a ramp-up of orders for 7nm chips, TSMC is still seeing orders for other advanced process nodes remain sluggish which has kept its overall 12-inch fab capacity in oversupply,...

Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...

TSMC will see its 7nm process utilization rate climb substantially in the second half of 2019, driven by a seasonal pick-up in demand for smartphones, as well as chip demand for HPC,...

ASE Technology has landed more customized SiP (system-in-package) backend orders than expected earlier this year thanks to growing demand for heterogeneous integration of 5G chips,...

Renesas is reportedly moving toward a fab-lite business model by temporarily shutting down some frontend and backend fabs, with its Taiwan-based OSAT partners including ASE, Ardentec,...