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NEWS TAGGED VIA
Tuesday 26 April 2022
CMMT develops Gibbon Film via cooperation with 3M
Cheng Mei Materials Technology (CMMT) has cooperated with 3M to develop Gibbon Film, an absorption- and reflection-type polarizer of ultra-large breadth with higher brightness by...
Monday 10 January 2022
Diodes steps into EV-use SiC-based power modules via JV
US-based semiconductor device maker Diodes has established DiodSent Green Technology on a joint-venture basis with Taiwan-based Sentec Group to step into R&D and production of...
Friday 24 December 2021
Edge AI solution provider Gorilla Technology to trade on Nasdaq via SPAC
Gorilla Technology Group, a leading edge analytics AI solution provider headquartered in Taiwan, will become a publicly-traded company on Nasdaq through the merger with Global SPAC...
Friday 3 December 2021
TSEC raises US$22 million via private placement
Solar cell and PV module maker TSEC has raised funds of NT$615.0 million (US$22.04 million) through issuing 25.895 million preferred shares at NT$23.75 per share for private placement,...
Monday 22 November 2021
Arm boosts development of software-defined EVs via joining MIH
Arm in October 2021 joined the MIH Alliance in a bid to promote the development of software-defined electric vehicles (EVs), according to senior director Simon Teng for Asia Pacific...
Friday 5 November 2021
Intel to take over Centaur
VIA Technologies has issued a company filing with the Taiwan Stock Exchange (TWSE) announcing plans to sell Centaur Technology, its wholly-owned subsidiary specializing in x86 CPU...
Tuesday 2 November 2021
Harvatek steps into heterogeneous integration packaging with YoungTek Electronics
LED packaging service provider Harvatek has stepped into heterogeneous integration packaging and packaging of LED devices integrated with ICs, through cooperation with IC testing...
Thursday 2 September 2021
Suppliers eyeing demand boom for high-speed transmission chip solutions
Taiwan's vendors of transmission interface chip solutions are stepping up the development and production of high-speed solutions such as Wi-Fi 6E, PCIe4.0/5.0 controller chips and...
Monday 16 August 2021
Ennoconn to introduce strategic investment from MediaTek, VIA Technologies
Industrial motherboard, POS (point of sale/service) device and kiosk maker Ennoconn will introduce MediaTek and VIA Technologies as long-term strategic partners via private placement,...
Friday 2 July 2021
Opto Tech seeking additional investment from Nichia
LED and Si-based sensor chip maker Opto Tech will issue 60 million new shares at a subscription price of NT$22.93 (US$0.82) per share for private placement, and Japan-based Nichia...
Friday 2 July 2021
SerComm to raise funds via private placement
Broadband communication/networking device maker SerComm will raise funds through issuing up to 50 million new shares or domestic convertible bonds worth up to NT$3.0 billion (US$107...
Friday 14 May 2021
URE to build energy storage system for Taipower
Solar cell and PV module maker United Renewable Energy (URE), through partnerships with electric machinery maker Shihlin Electric & Engineering and battery solution developer...
Monday 10 May 2021
JCET raises CNY5 billion via private placement
Jiangsu Changjiang Electronics Technology (JCET) has raised an additional CNY5 billion (US$777.4 million) in paid-in capital through private placement, according to the largest China-based...
Thursday 29 April 2021
Syncmold extending production
Hinge and TV/monitor stand maker Syncmold Enterprise is looking to extend production to hinges used in notebooks, and to components of fitness equipment, foldable devices, smart devices,...
Monday 26 April 2021
AUO striving to build versatile ecosystem via 3-pronged approach
With display becoming a crucial communication interface for smart living along with proliferating 5G, IoT and AI applications, AUO has kicked off a three-prong scheme seeking to build...