1282 news items tagged wafer
IDMs may evaluate more outsourcingTuesday 23 February 2021
IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.
China smartphone AP shipments – 4Q 2020Monday 22 February 2021
Fourth-quarter 2020 smartphone AP shipments to China-based vendors amounted to 211.6 million units, up 9.9% quarter-over-quarter and 7.7% year-over-year.
China remains largest IC marketMonday 22 February 2021
China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, China's IC market increased to US$143.4 billion, a 9% gain from US$131.3...
Kioxia, Western Digital announce 6th-gen 3D flash memoryFriday 19 February 2021
Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.
Winter storm in US to disrupt chip suppliesFriday 19 February 2021
The impact of winter storms that struck the US state of Texas could be significant on the world's supply of certain semiconductors, including high-end NOR flash and chips demanding...
TSMC could set up fab in EuropeThursday 18 February 2021
TSMC could set up an advanced wafer fab in Europe, where demand for leading-edge chip fabrication is promising, according to industry observers.
Top-5 wafer capacity leaders raise share of global capacity to 54%, says IC InsightsWednesday 17 February 2021
The top-5 wafer capacity leaders saw their combined installed capacity represent 54% of total global wafer capacity in December 2020, according to IC Insights. In 2009, the top-10...
TSMC ecosystem partners set to enjoy strong 1Q21Monday 8 February 2021
TSMC's ecosystem partners based in Taiwan are expected to post strong sales results for the first quarter of 2021, as well as the entire year, buoyed by brisk demand for chips fabricated...
Political pressure challenging TSMCMonday 8 February 2021
TSMC is believed to have been under political pressure to set up an advanced wafer fab locally in the US in the wake of the US-China trade war. The pure-play foundry has also come...
Notebook chips in tight supplyThursday 4 February 2021
The supply of notebook-use chips including display driver ICs, power management chips and audio codecs chips continues to fall short of demand in the first quarter of 2021 despite...
Eris to see orders transferred from Lite-On Semi start generating revenue in 3Q21Wednesday 3 February 2021
Diode maker Eris Technology is poised to obtain from Lite-On Semiconductor automotive diode production equipment which has been acquired by Eris' largest shareholder Diodes, and will...
Global 2020 silicon revenue remains stable with wafer shipments edging up, say SEMIWednesday 3 February 2021
Worldwide silicon wafer area shipments increased 5% in 2020, when revenue remained unchanged from 2019 at US$11.17 billion, according to SEMI.
Backend house Xintec expects strong 1Q21Wednesday 3 February 2021
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
VIS raises 2021 capexWednesday 3 February 2021
Eight-inch foundry Vanguard International Semiconductor (VIS) has budgeted NT$5.1 billion (US$182.33 million) in capex for 2021, up from the NT$3.54 billion allocated last year.
Fabless chipmakers worry about further supply constraintsTuesday 2 February 2021
With major Taiwan-based foundries expressing their supply commitments to their automotive customers, fabless chipmakers particularly second-tier players have expressed concerns about...
DDR3 prices to rise 40-50% in 2021Monday 1 February 2021
DDR3 prices are expected to rise 40-50% in 2021, according to industry sources who estimated previously a slower 30% increase.
UMC sees net profits top NT$10 billion in 4Q20Thursday 28 January 2021
Pure-play foundry United Microelectronics (UMC) saw its net profits exceed NT$10 billion (US$357.1 million) in the fourth quarter, with profits for 2020 reaching a 14-year high of...
Gudeng to sustain strong shipments of EUV pods in 2021Tuesday 26 January 2021
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solutions and wafer handling tools, has expressed optimism that its...
GlobalWafers raises bid to acquire SiltronicMonday 25 January 2021
GlobalWafers has announced that the price for its tender offer to all Siltronic shareholders has been increased to EUR145 (US$176.53) per share.
Rohm ramping up SiC power device outputFriday 22 January 2021
Rohm recently held an opening ceremony announcing the completion of a new building at its Apollo plant in Chikugo, Japan. The facility is to enhance the company's production capacity...
VIS to sustain growth momentum for 8-inch wafer foundry in 2021Monday 18 January 2021
Vanguard International Semiconductor (VIS), a dedicated 8-inch wafer foundry house, is optimistic that its revenues will sustain growth momentum in 2021 after surging 17.13% on year...
TSMC expects another record in 1Q21 revenueThursday 14 January 2021
TSMC expects to post revenues of between US$12.7 billion and US$13 billion in the first quarter of 2021, which is a 1.3% sequential increase at the midpoint. Gross margin and operating...
Major China MOSFET supplier raises pricesWednesday 13 January 2021
China Resources Microelectronics (CR Micro) has notified its clients based mainly in China about price hikes for all its power semiconductor products, including MOSFET and IGBT components,...
III-V IC players enjoy high capacity utilization for 5G, Wi-Fi 6 applicationsWednesday 13 January 2021
Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photonics Epitaxy (VPEC) and Intelligent...
UMC 8-inch fab capacity may tighten furtherTuesday 12 January 2021
A recent power outage at UMC's 8-inch wafer fabs may exert pressure on its already-tight supply of 8-inch wafer capacity, according to industry sources.
Winbond SpiStack memories
Photo: Company, Wednesday 30 March 2016
Micron 16nm flash die
Photo: Company, Tuesday 23 July 2013
KLA-Tencor 2910 series optical inspection system and eDR-7100 e-beam review tool
Photo: Company, Thursday 18 July 2013