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Thursday 19 December 2019
Kinwong, Plotech to build new HDI PCB capacities in China
Chinese PCB maker Kinwong Electronic and Taiwan-based peer Plotech Technology have both disclosed plans to set up new production lines for HDI boards in China seeking to cash in on...
Wednesday 18 December 2019
Worldwide wearables market to top 300 million units in 2019, says IDC
The global market for wearables is on track to ship 305.2 million units in 2019, up 71.4% from the 178 million units shipped in 2018, according to IDC. From there, total volumes will...
Wednesday 18 December 2019
Components makers find Apple orders less juicy
Apple has informed its upstream partners it will stop paying non-recurring engineering (NRE) fees for the development of new iPhones' chassis and metal frames, according to industry...
Wednesday 18 December 2019
Rigid-flex boards to stay as mainstream for midrange applications
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications...
Wednesday 11 December 2019
Worldwide wearables shipments surge 94.6% in 3Q19, says IDC
Global shipments of wearable devices totaled 84.5 million units in the third quarter of 2019, an on-year increase of 94.6% and a new record for shipments in a single quarter, according...
Monday 9 December 2019
Smart glasses may replace smartphones, says Jorjin chairman
Smart glasses enabled by AR/MR technologies may gradually replace smartphones, with such a trend beginning to emerge in 2023 according to Tom Liang, chairman for both Taiwan-based...
Friday 6 December 2019
Smart AR glasses shipments to rise significantly in 2023, says Digitimes Research
As 5G penetration rate is expected to reach 50% in 2023, smart augmented reality (AR) glasses will begin entering the consumer market, according to Digitimes Research.
Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Tuesday 3 December 2019
Sustainability and digitalization: Q&A with Covestro CEO Markus Steilemann
Germany-based Covestro, spun off from the Bayer Group in September 2015, is now among the world's leading makers of premium polymers with 30 production bases and around 16,000 employees...
Wednesday 20 November 2019
Anylayer HDI demand from Chinese handset vendors rising sharply
Chinese handset vendors are keen on utilizing anylayer HDI boards as mainboards for high-end smartphones adopting 7nm APs, and Taiwan-based PCB makers including Compeq Manufacturing...
Thursday 14 November 2019
Foxconn moving to transform into technology services provider
Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while...
Wednesday 13 November 2019
Inventec expects server sales to boom in 2020
Inventec expects to post a significant increase in its server business revenues next year when server shipments worldwide are expected to rebound by 4-6%, according to company president...
Thursday 7 November 2019
Acer sees strong profits in 3Q19
Acer has announced consolidated revenues of N$62.87 billion (US$2.05 billion) for the third quarter of 2019, growing 14% sequentially with gross margin of 10.6%. Net profit for the...
Wednesday 30 October 2019
Kinsus, Nan Ya reportedly among SiP substrate suppliers for new AirPods
Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...
Monday 21 October 2019
Acer unveils wearable for Catholics
Acer's wearable affiliate has cooperated with the Pope's Worldwide Prayer Network to jointly develop a new wearable, the Click to Pray eRosary.