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NEWS TAGGED WINBOND
Tuesday 21 June 2022
Macronix, Winbond focus more on non-consumer NOR flash
Macronix International and Winbond Electronics have both put increased sales focus on high-density NOR flash for 5G base stations and automotive electronics, as demand for consumer...
Thursday 16 June 2022
Winbond to further grow automotive flash sales in 2022
Winbond Electronics is poised to further expand its automotive flash offering as a proportion of company revenue in 2022, as the chipmaker has cut into the supply chains of first-tier...
Wednesday 8 June 2022
Winbond, Nanya to open new fabs, boost DRAM capacity
With increasing demand for larger-capacity memory devices, Taiwan-based specialty DRAM makers are ramping up production to strive for more market share, according to industry sourc...
Wednesday 25 May 2022
NOR flash prices to trend downward in 2H22
NOR flash memory contract prices will likely trend downward in the second half of 2022, according to industry sources. Prices for low-density chips have started to drop in the second...
Thursday 12 May 2022
Winbond to enjoy revenue growth in 2Q22
Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.
Monday 9 May 2022
Memory chips increasingly important in heterogeneous integration, says Winbond
The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...
Monday 25 April 2022
IC wafer capacity to climb 8.7% as 10 new fabs enter production
IC wafer capacity is forecast to grow 8.7% in 2022 after rising 8.5% in 2021, thanks to the addition of 10 new 300mm fabs that are scheduled to open this year, according to IC Insi...
Thursday 21 April 2022
Winbond to scale up DDR3 output
Winbond Electronics has disclosed plans to boost its DDR3 chip output, which will climb as a proportion of the company's total DRAM revenue to 50% by 2024 from the current 30%.
Wednesday 30 March 2022
Samsung to stop taking DDR3 orders after 2022
Samsung Electronics has notified customers that the company will take DDR3 chip orders until the end of 2022 and fulfill the orders for deliveries until the end of 2023, according...
Tuesday 22 March 2022
CXMT to deliver 17nm DRAM samples in 2Q22
China-based memory foundry ChangXin Memory Technologies (CXMT) is poised to start delivering samples of DRAM chips built using its in-house developed 17nm process technology, according...
Tuesday 8 March 2022
Taiwan memory makers post strong February sales
Memory module houses, such as Adata Technology, and Taiwan-based memory chipmakers including Nanya Technology, Macronix International and Winbond Electronics saw their February sales...
Wednesday 2 March 2022
Semiconductor industry capex to surge 24% in 2022
After surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of US$190.4 billion, according to IC Insights.
Wednesday 23 February 2022
Macronix, Winbond gaining market share
Macronix International and Winbond Electronics, with their combined share of the global NOR flash market exceeding 55% in the second half of 2021, are both looking to gain more market...
Friday 18 February 2022
Global DRAM output value drops in 4Q21
The global DRAM memory industry posted US$25.03 billion in output value in the fourth quarter of 2021, down 5.8% sequentially, when bit shipments and ASPs both declined on quarter,...
Monday 14 February 2022
Winbond to boost 20nm chip output at new fab in southern Taiwan
Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.