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NEWS TAGGED WINBOND
Wednesday 8 September 2021
Adata expects DRAM spot prices to be stable in 4Q21
Memory module maker Adata Technology expects price stability to take place in the DRAM spot market starting the fourth quarter of 2021.
Friday 3 September 2021
DDR3 contract prices likely to drop in 4Q21
DDR3 contract prices for the fourth quarter will be under downward pressure, as spot prices have been falling recently, according to industry sources.
Tuesday 17 August 2021
Nuvoton to raise foundry quotes by 15%, report says
MCU specialist Nuvoton Technology, which has merged with Panasonic Semiconductor Solutions (PSCS), has reportedly notified customers about a 15% price hike for its contract manufacturing...
Friday 13 August 2021
Winbond to generate additional output for specialty DRAM starting 4Q22
Winbond Electronics expects to kick off production for specialty DRAM memory in small volume at its new plant in Kaohsiung, southern Taiwan in the fourth quarter of 2022, according...
Friday 6 August 2021
Winbond expects full capacity utilization to remain till year-end 2021
Specialty memory IC maker Winbond Electronics has fully utilized monthly production capacity equivalent to 55,000-60,000 wafers, and strong demand will allow full utilization to last...
Thursday 22 July 2021
DDR3 prices to continue double-digit growth
Niche-market DDR3 memory prices will continue to register double-digit increases in the third and fourth quarters of 2021, due mainly to supply-side constraints, according to industry...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Thursday 15 July 2021
Rising NOR flash prices to boost Winbond 2021 profit
Winbond Electronics is expected to post handsome profits in 2021, buoyed by rising NOR flash prices, as well as growing sales generated by its logic IC subsidiary Nuvoton Technology,...
Tuesday 13 July 2021
VIS, Winbond post record 2Q21 revenue
Specialty IC foundry Vanguard International Semiconductor (VIS) and Winbond Electronics, a specialty DRAM and flash memory chipmaker, both saw their revenues hit record highs of NT$10.16...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Tuesday 29 June 2021
Nuvoton to improve product mix through acquisition
MCU specialist Nuvoton Technology will be able to improve its product mix, following its acquisition of Panasonic Semiconductor Solutions (PSCS) and Panasonic's other chipmaking assets,...
Friday 18 June 2021
Winbond intros 1.8V 512Mb SPI NOR flash for 5G, server apps
Winbond Electronics has announced it is expanding its total solution of SPI NOR flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash that can support...
Thursday 10 June 2021
NOR flash prices to soar in 3Q21
NOR flash prices are expected to rise 20-30% in the third quarter of 2021, as the memory supply becomes extremely tight, according to market sources.
Monday 7 June 2021
Winbond to see profit more than double in 2Q21
Rising specialty DRAM and NOR flash memory prices are set to boost net profits at Winbond Electronics in the second quarter of 2021, which are likely to more than double those generated...
Tuesday 1 June 2021
GigaDevice eyeing bigger share in TWS earbuds market
NOR flash chipmaker GigaDevice is reportedly ramping up its output at Hua Hong Semiconductor, eyeing a bigger share in the TWS earbuds market segment.
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.