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IC manufacturing
  • PSI has filed a lawsuit with the Taiwan IP court against Integrated Service Technology
    Wafer reclaim and thinning specialist Phoenix Silicon International (PSI) has filed a lawsuit with the Taiwan IP court against Integrated Service Technology (iST) accusing it of infringing its patent concerning wafer thinning process technology.
  • Semicon Taiwan 2019 opens
    Semicon Taiwan 2019 opens today, focusing on cutting-edge technologies, including those concerning 5G and AI, with its forums to feature heavyweight speakers from TSMC, ASE and others.
  • PTI has obtained orders for HPC solutions from China- and Taiwan-based fabless firms
    Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for high performance computing (HPC) solutions designed for AI and networking applications from China- and Taiwan-based fabless firms, according to sources familiar with the matter.
  • Advantest is presenting its latest solutions for 5G during the Semicon Taiwan 2019
    Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan 2019 that kicks off today.
  • The lead time for production of 7nm chips at TSMC has extended to nearly six months
    TSMC's clients reportedly have been eager to secure the foundry's 7nm production ccapacity, as strong demand from the smartphone and for the advanced node has resulted in tight supply with lead time extending. TSMC is expected to set...
  • Semiconductor market to rebound in 2020
    The global semiconductor market sales are forecast to increase 5-7% in 2020 following a decline this year, according to SEMI.
  • ASE will have its fan-out packaging technology ready in 2020
    Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP) modules and RF (radio frequency) front-end modules (FEM) for use in 5G devices, according to industry sources.
  • Win Semiconductors president Kyle Chen
    GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor foundry demand for 5G applications, according to company president Kyle Chen.
  • Corning to showcase an expanded range of precision glass substrates at Semicon Taiwan
    Corning has disclosed it will showcase an expanded range of precision glass substrates and supporting technologies for the semiconductor and consumer electronics industries at Semicon Taiwan.
  • 5G smartphone market to boom in 2020
    The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand, according to industry sources.
  • Semicon Taiwan tradeshow will take place in Taipei from September 18-20
    The annual Semicon Taiwan tradeshow will take place in Taipei from September 18-20, with this year's theme focusing on cutting-edge technologies enabling the semiconductor industry to work to extend silicon scaling beyond Moore's Law.
  • 80% of WWT's revenues come from IC test sockets
    As 7nm and more-advanced process nodes are increasingly applied to fabricating high-performance computing (HPC) CPUs and GPUs, demand for high-end IC sockets for SLT (system level test) and FT (final test) applications is getting robust, serving as a strong growth driver for WinWay Technology (WWT),...
  • Investments in new fab projects starting construction in 2020 to reach nearly US$50 billion
    Investments in new fab projects starting construction in 2020 are expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to SEMI.
  • OSE has seen clear order visibility through the end of 2019
    Memory modules specialist Orient Semiconductor Electronics (OSE) is expected to see its September revenues hit an all-time high for the third consecutive month, driven by a pull-in of orders for NAND flash devices, as well as orders for EMS services, according to market watchers,
  • Government-run science parks generated revenues totaling NT$1,218.942 billion in January-June 2019
    Government-run Hsinchu Science Park (HSP), Southern Taiwan Science Park (STSP) and Central Taiwan Science Park (CTSP) generated revenues totaling NT$1,218.942 billion (US$38.88 billion) in January-June 2019, slipping 2.47% on year, according to statistics released by the Ministry of Science and Technology...
  • TSMC, UMC and VIS together generated total revenues of US$9.13 billion in the second quarter
    With global market demand on a moderate increase in second-quarter 2019, Taiwan-based semiconductor foundries showed recovery. Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) and Vanguard International Semiconductor (VIS) together generated total revenues...
  • Spirox CEO Henry Kao (right)
    Taiwan-based Spirox, a distributor of packaging and testing equipment, has formed a partnership with National Instruments (NI) and expects their cooperation to bear fruit in 2020.
  • Taiwan backend houses expect to see stable growth in demand for baseband chips and LCD driver ICs
    Taiwan-based backend houses including KYEC and Chipbond expect to see stable growth in demand for baseband chips and LCD driver ICs for Apple iPhone.
  • DuPont to sell its compound semiconductor solutions business to SK Siltron
    DuPont Electronics & Imaging has announced it has signed an agreement to sell its compound semiconductor solutions (CSS) business to SK Siltron. The transaction is expected to close by the end of 2019, subject to customary regulatory approvals for closing.
  • Apple next-generation AirPods is likely to be available soon
    Apple has just released its new iPhones and smartwatch, and its next-generation AirPods is likely to be available soon. Supply chain sources have disclosed that ODMs will begin mass assembly of the new AirPods as early as October to meet...
  • ASE is expected to generate sequential revenue increases through the last quarter of 2019
    IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables and other portable devices, according to industry sources.
  • Acter has enjoyed an influx of orders particularly from its Taiwan-based clients
    Cleanroom and turnkey equipment supplier Acter has enjoyed an influx of orders particularly from its Taiwan-based clients looking to relocate their manufacturing operations back home or to Southeast Asia from China. It expects revenues to ramp up steadily from the second half of 2019 to 2020.
  • Global demand for 5G CPE is expected to grow rapidly to 120 million units in 2025
    Global demand for 5G CPE (customer premise equipment) is expected to grow rapidly to 120 million units in 2025 from 100,000 units in 2019, prompting chipmakers such as Qualcomm and Huawei HiSilicon to step up rolling out relevant chip solutions, which in turn will provide new business opportunities...
  • TSMC saw its August revenues climb to a record high of NT$106.12 billion
    Taiwan Semiconductor Manufacturing Company (TSMC) saw its August revenues climb to a record high of NT$106.12 billion (US$3.4 billion).
  • VIS generated August revenues of NT$2.29 billion
    Pure-play foundries United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have both reported sequential decreases in August consolidated revenues of nearly 4% and 8%, respectively.

Taiwan handsets – 2Q 2019

Taiwan LCD monitors – 2Q 2019

Taiwan small- to mid-size LCD panels – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

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