Chinese handset vendors are eager to adopt anylayer HDI boards for their high-end smartphones, but they currently have to source such boards from outside of China despite the country's bid to raise self-sufficiency for electronics components. Taiwan-based PCB makers Compeq...
Discrete power components supplier Panjit International is set to release its second-generation SiC diodes in February 2020 to tap the lucrative market for wide band-gap (WBG) power devices that is just taking off, according to the firm's chief strategy officer Jasper Lee.
Chin-Poon stays cautious about automotive PCB demand
Chin-Poon Industrial remains cautious about demand for automotive electronics, which is unlikely to pick up until 2020, according to the PCB manufacturer.
Chinese handset vendors are keen on utilizing anylayer HDI boards as mainboards for high-end smartphones adopting 7nm APs, and Taiwan-based PCB makers including Compeq Manufacturing and Unimicron are in a better position to meet the growing demand thanks to their higher yield rates and technology levels...
Taiwan-based PCB and IC substrate supplier Unimicron Technology has disclosed plans to invest a total of about US$74.9 million for capacity expansions at its plants in China in 2020.
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The acquisition is expected to turn Yageo into a global top-3 passive components vendor along with Murata and Semco.
Highlights of the day: PCB makers ready to work overtime
The handset supply chain is expected to bid farewell to 2019 with much improvements from those disappointing results seen during the end of 2018 when the handset market was hit by a demand chill. Taiwan-based PCB makers have seen order visibility extend to early 2020, and they are now ready to keep...
Demand for anylayer HDI boards from Chinese handset vendors has been increasing sharply as such boards are badly needed for carrying 7nm APs, now mainstream core SoCs for their smartphones, according to industry sources.
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset vendors extending to early 2020, according to industry sources.
HDI boards to enter new wave of growth in 5G, IoT era
Supply of HDI (high-density interconnect) boards has fallen short of demand in the second half of 2019, with Taiwan makers having to reschedule shipments to fulfill mounting orders. HDI boards, now mostly used in handsets, are expected to see a major rise in demand after entering the IoT era to support...
China's bid to increase semiconductor self-sufficiency will take a step further - albeit a small one, perhaps - as homegrown DRAM maker CXMT is ramping up 19nm production. CXMT's goal is to reach an output of 40,000 wafers monthly for the 19nm...
Nan Ya set to expand ABF substrate capacity in 2020
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity to meet rapidly growing demand.
PCB maker Zhen Ding plans record capex for 2020
Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments of diverse product lines, according to company chairman Charles Shen.
Taiwan-based PCB suppliers Compeq Manufacturing and Tripod Technology have both disclosed strong earnings for the third quarter of 2019 and that tight capacity for any-layer HDI boards for smartphone applications may continue through the fourth quarter of 2019.
HDI PCB makers to expand output in 2021
High-density interconnection (HDI) PCB specialists including Compeq Manufacturing and Tripod Technology are both scheduled to have their new production capacities come online in 2021 to satisfy demand for diverse consumer electronics applications enabled by 5G.
Yageo to acquire Kemet
Taiwan-based Yageo and US-based Kemet have announced that they have entered into a definitive agreement under which the former Yageo will acquire all of the outstanding shares of the latter's common stock for US$27.20 per share in an all-cash transaction valued at US$1.8 billion, including the assumption...
AboCom ramping up revenues on VCSEL shipments
Wireless networking solution provider AboCom System has disclosed its monthly sales increased 19.78% on month and 20.55% on year to hit a record high of NT$163 million (US$5.36 million) in October, driven by shipments of its VCSEL chips.
Taiwan's niche-type compound semiconductors makers including Intelligent Epitaxy Technology (IntelliEPI), Transcom and Global Communication Semiconductors are poised to embrace significant growth momentum in 2020, driven by stronger demand for III-V components including diverse RF and other power devices...
Diode maker Eris cautious about 1Q20
Diode supplier Eris Technology, which has put increased focus on automotive electronics applications, has expressed caution about its sales outlook for the first quarter of 2020.
Server demand may have been slow in 2019 with clients adjusting inventory, but orders are expected to pick up in 2020. Major suppliers are eyeing different segments for server shipment growth. The year 2020 is promising not just for the...
Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be launched in 2020, according to industry sources.
China has recently offered to allow Taiwan-based firms to join the country's 5G technology R&D, standards formulation, network construction and product test, but most Taiwanese semiconductor supply chain players have remained cautious and even silent in response.
Semiconductor players including TSMC, UMC as well as GaAs foundries and backend firms are seeing their production utilization rates picking up as demand from clients and emerging applications has been rising. Meanwhile, demand for chips used in TWS earphones is also expected to soar in 2020.
China PCB firm to expand production capacity
China's Dongshan Precision Manufacturing (DSBJ) has disclosed a plan to invest a total of CNY2.16 billion (US$307.9 million) in its new PCB capaciy expansion project.
Chip demand for TWS devices to surge sharply in 2020
Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong revenue growth momentum for Taiwan's chips supply chain players next year, according to industry sources.
Taiwan notebooks – 3Q 2019
Taiwan's notebook shipments rise 1.8% sequentially and 8.6% on year to come to 34.14 million in the third quarter of 2019.
China smartphone AP shipments – 3Q 2019
Third-quarter-2019 smartphone AP shipments to China-based vendors came to 210 million units, down 1.8% on quarter and 9.4% on...
Global server market – 3Q 2019
Global server shipments grew 11.2% sequentially in third-quarter 2019 with inventory depletion that began from the second-half...
Global LCD panel shipment forecast, 2020 and beyond
Global small- to medium-size LCD panel shipments are estimated to drop from 2020 to 2024, while large-size ones will continue...
Global mobile device shipment forecasts, 2020 and beyond: Smartphones, notebooks and tablets
Notebooks, smartphones and tablets are expected to see mixed shipment performances in 2019. Notebook shipments will grow mildly...
Taiwan semiconductor foundry sector, 2Q19
According to Digitimes Research's observation, with global market demand on a moderate increase in second-quarter 2019, Taiwan-based...