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Brief: Chipbond raises 2004 capex

Cage Chao, Taipei; Jack Lu, DIGITIMES Asia Monday 10 May 2004 0

Chipbond Technology has decided to boost its 2004 capital expenditure (capex) to NT$2.6 billion from NT$400 million it earlier planned, said company president Fei-jian Wu in a May 5 investor conference.

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