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Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged Chips + Components [back to index]

US-Taiwan partnerships: Q&A with Arati Shroff, deputy chief of Economic Section at AIT

Thursday 17 June 2021

Small sensors, big goals: Q&A with ForceN CEO Robert Brooks and VP of engineering Albert Chen

Thursday 13 May 2021

Singapore can be springboard into ASEAN, says Singaporean trade representative in Taipei

Wednesday 21 April 2021

Virtual Antenna: Q&A with Ignion VP of innovation Carles Puente

Wednesday 7 April 2021

Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng

Tuesday 16 March 2021

Epi-wafer key to compound semiconductor: Q&A with VPEC chairman Jian-Lian Chen

Wednesday 10 March 2021

Contract PCB drilling service: Q&A with Key Ware CEO Chen Po-ying

Wednesday 24 February 2021

WPG to build last mile in semiconductor supply chain at Taoyuan Aerotropolis

Wednesday 27 January 2021

Smart logistics vision for next 30 years: Q&A with WPG Holdings vice chairman Frank Yeh

Tuesday 26 January 2021

Semiconductor knows no borders: Q&A with Silicon Catalyst partners

Monday 4 January 2021

Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan

Wednesday 30 December 2020

Transformation in next 30 years: Q&A with WPG Holdings CEO Frank Yeh

Friday 18 December 2020

All-round OSAT: Q&A with PTI CEO Boris Hsieh

Monday 14 December 2020

'IT' partnerships: Q&A with Manik Mumar from ELCINA

Monday 30 November 2020

Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu

Friday 20 November 2020

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu

Monday 26 October 2020

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong

Monday 5 October 2020

Opportunities amid macro uncertainty: Q&A with Avnet Asia-Pacific president Prince Yun

Monday 21 September 2020

Chips R&D matters: Q&A with iST chairman Danny Yu

Tuesday 8 September 2020

More choices for gamers: Q&A with Frank Soqui, GM of Intel Gaming Division

Thursday 3 September 2020

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng

Wednesday 26 August 2020

Support for startups: Q&A with Arm Taiwan president CK Tseng

Tuesday 21 July 2020

Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu

Wednesday 15 July 2020

No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng

Tuesday 16 June 2020
1/24 pages

Taiwan large-size LCD panels – 1Q 2021

Taiwan small- to mid-size LCD panels – 1Q 2021

Global tablet market – 1Q 2021

Global server shipment forecast and industry analysis, 2021

China semiconductor industry: From 13th 5-year Plan to 14th 5-year Plan, 2015-2025

Global LCD panel shipment forecast, 2021 and beyond