The second edition of the 2024 Chroma Precision Machinery and Measurement Technology Paper Award, organized by the Chroma Foundation and co-organized by the Industrial Technology Research Institute (ITRI), has concluded successfully.
Rugged embedded computer brand—Cincoze has launched two new compact embedded computers in the Rugged Computing—DIAMOND product line. The DA-1200 is a palm-sized device suitable for most industries' basic applications and at a price point that has made it a popular choice among customers for many years. With this latest performance boost, it will likely remain a top choice. The DV-1100 supports the latest 13th/12th generation Intel Core CPUs, providing powerful performance in a streamlined configuration and maximizing cost-effectiveness. It is recommended for industrial sites with high-performance computing needs but limited installation space, such as smart manufacturing, machine vision, and railway computing.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded Phase Change Memory (ePCM) to support next-generation embedded processing devices. This new process technology, co-developed by ST and Samsung Foundry, delivers a leap in performance and power consumption for embedded processing applications while allowing larger memory sizes and higher levels of integrating analog and digital peripherals. The first next-generation STM32 microcontroller based on the new technology will start sampling to selected customers in the second half of 2024, with production planned for the second half of 2025.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed a new high-performance device that punches above its weight by combining the performance, scalability, and security of microprocessor-based systems that are typically more complex with the simplicity and integration of microcontrollers (MCUs).
According to statistics, the global number of connected devices reached 16 billion by 2023, more than double the global population! However, there are many device manufacturers who have yet to adopt security by design principles leading to hacking and privacy risks at the population level. To protect consumers many governments consider device security as a crucial national security issue and are in the process of legislating for its implementation. This trend will impact the entire electronics industry, from IP, chips, software and end devices, posing a challenge for stakeholders to comply with various security regulations and laws.
With net zero carbon emissions becoming a global commitment, an automotive industry revolution gets well underway. TAIPEI AMPA and AUTOTRONICS TAIPEI 2024 will take place April 17-20 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) in concurrence with 2035 E-Mobility Taiwan at the same venue. The three joint exhibitions will cast a spotlight on Taiwan's all-round automotive industry ecosystem as well as local and foreign iconic manufacturers' product roadmaps and technological strengths to help event participants capture next-generation mobility market opportunities.
Rugged embedded computing brand - Cincoze, will be at Embedded World 2024 (Hall 1, Booth 1-260) in Nuremberg, Germany, on April 9-11, 2024. Cincoze will display its range of world-class industrial embedded computing products around the theme of "Comprehensive AI Edge Computing Solutions," encompassing the full spectrum of industrial application environments in four dedicated zones, including the Rugged Embedded Fanless Computers, Industrial Panel PCs & Monitors, Embedded GPU Computers, and New Products.
Darveen Co., Ltd., a global provider specializing in rugged industrial computer solutions, is set to make a significant debut at Embedded World 2024 (Hall 3, Booth 3-230) in Nuremberg, Germany from April 9th to 11th, 2024. With a thematic focus on 'Embedded Solutions for Resilient Guidance and Steady Progress', Darveen presents a comprehensive display across three exhibition areas, showcasing a diverse range of industrial embedded product solutions meticulously designed for various industrial applications.
SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company made public its success with the HBM3E development just seven months ago.
NEXCOM, a leading industrial computer manufacturer, has long been dedicated to edge computing and industrial IoT solutions. Its Mobile Computing Solutions Business Unit (MCS) focuses on the Edge AI railway and in-vehicle application fields.
