With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy rising demand from the PCB industry. Meanwhile, suppliers of CCLs, IC substrates and flexible PCBs are also expected to enjoy growing orders in the upcoming months. The trend will go the same for memory backend firms including OSE and ChipMos thanks to orders from downstream modules makers.
Memory backend firms see bright revenue prospect for 2H19: Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half of 2019 on stable increases in orders from memory modules makers such as Phison Electronics, Kingston Technology, Longsys Electronics and Adata Technology, according to industry sources.
CCL makers keen on capacity expansion to brace for 5G-driven demand: With CCL (copper clad laminate) deemed as the most crucial material for high-end PCBs for 5G applications, major CCL makers in Taiwan and China are actively proceeding with capacity expansions seeking to ready sufficient capacities to meet explosive demand expected to come after 5G commercialization, according to industry sources.
CCL, IC substrate and flexible PCB demand to boom in 5G era: Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020. In the PCB industry supply chain, suppliers of CCLs, IC substrates and flexible PCBs are being pinpointed as among the beneficiaries.
