TSMC has been devoting a lot of efforts to developing packaging technology in line with its efforts to extend the validity of Moore's Law. The foundry house's packaging technology development is expected to remain focused on SoIC and organic interposer in 2021. Its major foundry rival, Samsung, is also stepping up development of packaging technology. For Intel, Moore's Law remains an inspiration for its chip development, according to the company's chief architect Raja Koduri.
TSMC packaging development to remain focused on SoIC, organic interposer in 2021: TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated WSE (wafer-scale engine) AI chips for Cerebras with InFo-SoW packaging process and second-generation 7nm node, according to industry sources.
Samsung stepping up efforts for advanced chip packaging: Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry observers.
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri: At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars of technology innovation - process, architecture, memory, interconnect, security and software - for the firm's future development roadmaps. Koduri served as SVP and chief architect of the Radeon Technologies Group at AMD before joining Intel in 2017.
