Figure 1The Number of AI Companies Acquired by Leading Companies from 2017-2023
Figure 2Overview of Parameters in Leading Large Language Models and Their Development Direction
Figure 3A Comparative Overview of the Ability Test of Edge Small Language Models
Figure 4The Development Process of Generative AI Software and Hardware
Figure 5The Three Major Bottlenecks in The Supply and Demand of Cloud AI Servers
Figure 6The Three Major Bottlenecks in Running LLM Model Applications on Terminal Devices
Figure 7The Applicable Range of Model Parameter Sizes for Cloud and Edge AI, and Suitable Types for Generative AI Tasks
Figure 8Types of Server AI Accelerators
Figure 9High-End Cloud GPU Shipment Forecast 2023-2024
Figure 10Forecasts of Market Share of High-End Cloud GPU Shipments (2023~2024)
Figure 11Development Roadmaps of High-End Cloud GPUs by Major Makers 2023-2026
Figure 12Forecast of High-End Cloud GPU Shipments and Annual Growth Rate from 2023-2028
Figure 13Global Cloud-End ASIC Accelerator Shipment Forecast 2023-2024
Figure 14Development Roadmap of Major Players for Cloud ASIC Accelerators 2023-2024
Figure 15Product Roadmaps of Cloud ASIC Accelerators 2023-2026
Figure 16Forecast of Global Cloud ASIC Accelerator Shipments and Annual Growth Rate 2023-2028
Figure 17Forecast of the Global HBM Market for AI Chips 2023-2028
Figure 18Comparison of HBM Specifications Across Different Generations and Their Mass Production Years
Figure 19Production Times for Different HBM Generations by SK Hynix, Samsung and Micron
Figure 20Production Times Lines and Process Nodes for HBM3e, HBM4 by Three Major Players
Figure 21Korean Memory Makers’ Business Strategy and Direction on Customized HBM Market
Figure 22Description of the Features of Generative AI on PCs and Smartphones
Figure 23Two Major Mainstream CPUs Launch New Products to Lay Out the AI PC Market
Figure 24Comparison of AP Specifications of Top Five AP Vendors
Figure 25Key Observation of AI Smartphone APs and Generative AI Strategies of Top Five AP Makers
Figure 26Development Roadmaps/Trends of the Top 5 Smartphone AP Products
Figure 27Global AI Smartphone AP Shipment Forecast 2023~2028
Figure 28Forecast of Global AI Smartphone Shipments and Penetration Rate 2023－2028
Figure 29Generative AI and AI PC Ecosystem
Figure 30Specification Comparison of Major AI NB CPU 2023~2025
Figure 31Current Status of PC Operating Systems and Their AI Applications in AI PC Development
Figure 32Global AI PC Processor Shipment Trends and Forecast 2023-2028
Figure 33AI PC Shipment Forecasts 2024
Figure 34Roadmap for Developing Advanced Wafer Foundry Processes
Figure 35Roadmaps and Comparison of EUV and Nano Imprint Technology
Figure 36Transformation of Transistor Structure
Figure 37Comparison of Transistor Power Supply Solutions and the Timing of Industry Adoption
Figure 38Changing Proportion of DTCO’s Contribution to Chip Performance Improvement
Figure 39Pathways for Chip Performance Improvement
Figure 40Maps Combine with Generative AI to Improve User Interaction Experience
Figure 41Advantages and Disadvantages of FOPLP Compared to FOWLP
Figure 42Schematic Diagram of SoC and Chiplet
Figure 43Chiplet Technology
Figure 44TSMC LIPINCON Interconnect Technology
Figure 452.5D Packaging Solutions and Characteristics Comparison
Figure 46Interposer Size and Component Integration Trends
Figure 47Evolution of CoWoS Technology
Figure 48Evolution of Chip Packing
Figure 49Comparison of Micro-Bump Bonding and Hybrid Bonding
Figure 50Features, Advantages and Disadvantages of Glass Substrates
Figure 51Co-Packaging Optical and Light Engine Packaging Solutions
Figure 52Advanced Packaging Technology Roadmap for AI Server Accelerators
Figure 53Summary of Major Foundries’ Advanced Process Roadmaps below 5nm
Figure 54Capacity Planning for Wafer Foundry Advanced Processes below 5nm
Figure 55Proportion of Wafer Foundries with Advanced Processes below 5nm
Figure 56Locations for Advanced Packaging Deployments by Wafer Foundries
Figure 57Estimate of TSMC’s CoWoS Annual Capacity
Figure 58Wafer Foundry Advanced Manufacturing Technology Roadmaps 2023-2028
Figure 59Wafer Foundry Advanced Packing Technology Roadmaps 2023-2028
Figure 60AI Applications and AI Chip Ecosystem
