Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range. Two newly launched industrial computers (P2202 Series and P1201), released in 2023, have been widely favored by customers for their thin and light design, especially in mobile devices (AGV/AMR), control cabinets, and other space-constrained applications. Among their striking designs, the One Computer / Two Purposes function has attracted particular attention. They are not only slim embedded computers but, through the patented CDS (Convertible Display System, Patent no. M482908) technology, can also be transformed into panel PCs. They provide performance, screen size, display ratio, and touch options for various application environments, thereby creating diverse and flexible HMI and KIOSK applications.
In 2019, Amazon, Apple, Google, and Zigbee Alliance members came together to form Project Connected Home over Internet Protocol (CHIP), a working group building a new standard that enables IP-based communication across smart home devices, mobile apps, and cloud services, and ultimately unites the smart home.
iCatch Technology, a leading AI image processing IC design company, announced today a collaboration with Valens Semiconductor, a world leader in high-performance connectivity solutions, on an innovative AI-enhanced multi-channel surround view monitoring system based on Valens Semiconductor's MIPI A-PHY high-speed and long-range sensor connectivity technology. The live demonstration of this system will be featured at Automotive World Tokyo 2024 Booth E42-20 from January 24 to 26.
CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance. CXL, built upon PCIe interfaces, supports memory expansion beyond DIMM slots, overcoming the latency gap between main memory and SSD storage. It is crucial for AI applications, offering increased memory capacity and bandwidth, and contributing to high-performance computing.
ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI.
In a strategic move aimed at expanding its presence in the Taiwan market, Crypto Quantique, a prominent quantum-safe cybersecurity solutions provider, has unveiled a strategic partnership with iMQ Technology, a leading innovator in MCUs (Microcontrollers) and security chips.
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane, the highest UCIe speed, for AI/HPC/xPU/Networking applications. UCIe 32G chiplet interface provides an industry-leading bandwidth density 10Tbps per 1mm of die edge (5Tbps/mm full duplex). The chip uses TSMC's N3P silicon process and CoWoSR advanced packaging technology.
Lelon Electronics started as an OEM contract manufacturer of aluminum capacitors 47 years ago. It has since evolved into one of the world's top ten aluminum capacitor makers. Lelon recently embarked on constructing state-of-the-art production plants in Suzhou, China, and Thailand to satisfy the demand for automotive, high-performance computing, and other applications. The current expansion strategy will give Lelon more agility and flexibility in its business operations, enhancing its adaptability in response to recent changes in global politics and economics.
SK Hynix held a press conference titled "Memory, the Power of AI" on the sidelines of CES 2024 in Las Vegas where its CEO Kwak Noh-Jung laid out the company's vision in the AI era.
ThroughTek Co., Ltd. (TUTK), a solution provider of AI-IoT cloud platform services, will be exhibiting at CES in Las Vegas from January 9, 2024, to January 12, 2024, at booth 50342 in the Venetian Expo. With the theme "Cloud Services for IoT Device Community," TUTK will showcase a series of IoT products and smart PaaS solutions at CES 2024, focusing on P2P Connection, Hausetopia App, Cloud Recording (VSaaS PaaS), DMP (Data/Device Management Platform), Cloud VMS (Video Management System), and more. These products and solutions can help businesses swiftly implement cloud management of videos, data, and IoT devices, and establish an interconnected IoT device community facilitated by TUTK.
