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NEWS TAGGED 0.18-MICRON
Wednesday 3 February 2021
VIS raises 2021 capex
Eight-inch foundry Vanguard International Semiconductor (VIS) has budgeted NT$5.1 billion (US$182.33 million) in capex for 2021, up from the NT$3.54 billion allocated last year.
Monday 21 September 2020
Qualcomm seeking to shift orders from SMIC, says report
Executives at Qualcomm have paid visits to Taiwan-based pure-play foundries for the purpose of securing capacity support if deliveries from China's Semiconductor Manufacturing International...
Monday 15 October 2018
Hua Hong starts volume production for second-generation 0.18-micron 5V/40V BCD process platform
China-based pure-play foundry Hua Hong Semiconductor has announced that its second-generation 0.18-micron 5V/40V BCD process platform has been successfully mass-produced.
Thursday 2 August 2018
Allegro, UMC sign long-term supply deal
Allegro MicroSystems, which develops high-performance power and sensing semiconductors, has signed a long-term deal with United Microelectronics (UMC) under which UMC will remain...
Wednesday 15 November 2017
SMIC 3Q17 profits fall
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has announced revenues of US$769.7 million in the third quarter of 2017, up 2.5% sequentially but down...
Friday 13 October 2017
ACTT complete IoT solutions available on SMIC 55nm eFlash platform
Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...
Thursday 22 June 2017
Faraday MFP ASIC shipments rise at CAGR of 38%
Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
Monday 1 August 2016
UMC qualifies 0.18-micron BCD process for auto chips
United Microelectronics (UMC) has verified on silicon its 0.18-micron Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive chips, according to the foundry...
Tuesday 7 April 2015
NewEdge Technology shipping wireless charging ICs in volume
China-based NewEdge Technology has started shipping its wireless charging ICs in volume. The chips are being manufacturing using TSMC's 0.18-micron technology, according to industry...
Tuesday 24 March 2015
Hua Hong, eMemory partner to develop MCUs for IoT
Hua Hong Semiconductor and eMemory Technology have jointly announced they will further strengthen their strategic partnership and work together in the field of microcontrollers (MCU),...
Tuesday 12 August 2014
More IC vendors seeking wafer production capacity at foundry houses other than TSMC
More fabless IC design houses are seeking wafer production capacity at Samsung Electronics, Globalfoundries, United Microelectronics Corporation (UMC) and Semiconductor Manufacturing...
Tuesday 16 October 2012
Silterra 0.18-micron embedded flash technology enters mass production
Malaysia-based IC foundry Silterra has announced the production release of its 0.18-micron embedded flash technology, dubbed C18E. Silterra has licensed SuperFlash technology from...
Wednesday 14 September 2011
UMC develops 0.18-micron MTP technology
United Microelectronics (UMC) has announced that under a joint development with IC design house Yield Microelectronics (YMC), it has developed a new 0.18-micron multiple-time programmable...
Thursday 1 September 2011
UMC launches 1.8-5V embedded EEPROM processes
United Microelectronics Corporation (UMC) has announced breakthroughs in its development of embedded EEPROM (eEEPROM) process technologies, which deliver an I/O voltage range of 1.8V-5V...
Tuesday 30 August 2011
Dongbu HiTek launches 180nm processes for analog, power and mixed-signal chips
Dongbu HiTek, a South Korea-based contract chipmaker, has announced the availability of two new specialized process technologies at the 180nm node for implementing advanced analog,...