IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.

TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solutions and wafer handling tools, has expressed optimism that its...

China Resources Microelectronics (CR Micro) has notified its clients based mainly in China about price hikes for all its power semiconductor products, including MOSFET and IGBT components,...

United Microelectronics (UMC) has raised its 12-inch foundry quotes to reflect tight capacity at its fabs, according to the contract chipmaker.

Winbond Electronics is constructing a new 12-inch wafer fab in Kaohsiung, southern Taiwan, which is scheduled to come online in the first half of 2022, according to the specialty...

GlobalWafers has run all its production lines for 12-, 8- and 6-inch silicon wafers at full capacity, according to company chairperson Doris Hsu. The silicon wafer supplier plans...

TSMC chairman Mark Liu has dismissed recent speculation that claimed a cutback in 5nm chip orders from Apple would drag down the foundry's 5nm process capacity utilization to 80%...

Pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) is in talks to rent new 12-inch fab equipment from a panel customer who intends to secure sufficient production capacity...

Photomask supplier Taiwan Mask (TMC) has expressed optimism about its operations in 2021, citing robust demand from 8-inch and 12-inch foundries for mature-node manufacturing.

TSMC has decided to build new facilities at its 12-inch fab in Nanjing to satisfy growing demand from the foundry's local customers in China, according to a report by Taiwan's Central...

Thanks to high capacity utilization at foundry and backend houses, IC materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all optimistic...

Micron Technology has expressed its concerns to DRAM module manufacturers that chips developed by China-based ChangXin Memory Technologies (CXMT) may violate its patents, according...

With Semiconductor Manufacturing International (SMIC) at risk of being blacklisted by the US government, concerns are growing about whether China-based memory chipmakers ChangXin...

Taiwan's vendors of LCD driver ICs and MOSFET chips are mulling raising their quotes to reflect increased costs resulting from tight capacity at 8-inch or even 12-inch wafer fabs,...

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...

CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...

Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...

Silicon wafer manufacturer GlobalWafers has reported net profits grew 18% sequentially to NT$3.4 billion (US$115.5 million) in the second quarter, with net profit margin hitting a...

TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.

Micron Technology remains optimistic about its operations in the fourth quarter of fiscal 2020, thanks to continued strong demand for data center applications, and the company's efforts...

Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...

Winbond Electronics has been stepping up its deployment in the high-density NOR flash field, gearing up for a boom in demand for 5G related applications, according to company president...

TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...

Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...