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    Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
    1min ago
    France draws Taiwanese investment projects worth EUR7.5 billion
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    NEWS TAGGED AI
    Tuesday 28 July 2026
    Anthropic CEO denies seeking open-weights ban, outlines national security priorities

    Anthropic CEO Dario Amodei pushed back Monday against accusations that his company has lobbied to ban open-weights AI models, clarifying...

    Tuesday 28 July 2026
    Robot boom heats up as Taiwan chipmakers race to catch up
    Cloud AI chip giants are stepping up investment in robot applications, putting robots back at the center of industry debate. For Taiwanese chipmakers, the broad range of robot use...
    Tuesday 28 July 2026
    Nvidia leads new Open Secure AI Alliance to build shared cybersecurity defenses

    More than 40 technology companies launched the Open Secure AI Alliance on Sunday, a new initiative to develop open-source tools and...

    Tuesday 28 July 2026
    Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
    Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and app...
    Tuesday 28 July 2026
    Apple, Micron's clash over CXMT puts White House in the middle
    Apple and Micron are fighting over whether the smartphone maker can buy memory chips from Chinese manufacturer ChangXin Memory Technologies (CXMT) for non-US devices, a move opposed...
    Tuesday 28 July 2026
    Moonshot AI opens Kimi K3 weights, challenging US closed-model economics

    Moonshot AI officially released the model weights for its Kimi K3 large language model on July 27, allowing developers to download,...

    Tuesday 28 July 2026
    Nvidia's Vera targets AI server growth, with CSP adoption the key test
    Nvidia is pushing into the server CPU market with its Vera chip as AI infrastructure competition enters a new phase, seeking to evolve from a chip supplier into a full AI computing...
    Tuesday 28 July 2026
    From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
    The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies...
    Tuesday 28 July 2026
    Energy storage unicorn expands in Baotou as China's industry chain accelerates integration
    Inner Mongolia HyperStrong Technology is a major production subsidiary established by Beijing HyperStrong Technology in Baotou, Inner Mongolia. Its development offers a useful case...
    Tuesday 28 July 2026
    Optics remain hardest technological hurdle for smart glasses, says Jorjin chairman
    Jorjin Technology chairman Wen-lung Liang believes that smart glasses that combine AI with spatial computing are the next smartphone-killers, going beyond mere hardware upgrades to...
    Tuesday 28 July 2026
    Smart glasses with color displays could enter mass production by 2028
    Taiwan's smart glasses supply chain urgently needs to break down technical silos and move first, according to industry executives speaking at a forum on July 24 on the outlook for...
    Tuesday 28 July 2026
    China faces AI compute divide as advanced capacity falls short and lower-tier resources sit underused
    China's AI computing infrastructure is developing along two sharply divergent paths. As large language models and AI agents gain traction across industries, rapidly rising token consumption...
    Monday 27 July 2026
    South Korea, AMD team up to integrate homegrown NPUs with CPUs and GPUs
    South Korea and AMD have agreed to build and demonstrate heterogeneous AI computing infrastructure integrating AMD CPUs and GPUs with homegrown neural processing units, as Seoul seeks...
    Monday 27 July 2026
    Apple reportedly delays smart glasses launch to late 2027 due to privacy risks
    Apple plans to present its first smart glasses during its Worldwide Developers Conference (WWDC) in June 2027 before opening them for sale later in the year. This timeline has reportedly...
    Monday 27 July 2026
    Samsung converts AMD and OpenAI ties into HBM4 supply wins

    Samsung Electronics is showing renewed momentum in the AI memory race as it deepens ties with both OpenAI and AMD, two partnerships...

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    BIZ FOCUS
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    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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