Taiwan-based Answer Technology (ANStek), which distributes mainly ICs for niche-market applications, has seen its customers place orders with caution as a result of a slower-than-anticipated...

The "Cross-Strait +1" supply chain layout is quietly taking shape. For the semiconductor packaging and testing industry that emphasizes capacity and labor-intensive processes, the...

Samsung Electronics' "Samsung System LSI Technology Day" is expected to be held in early October in Silicon Valley, USA. Market sources said the event may include and announcement...

Samsung Electronics' newly unveiled foldable phones Galaxy Fold5/Flip5, as well as Galaxy Tab S9 series are all equipped with the Qualcomm's "Snapdragon 8 Gen2 for Galaxy" APs, which...

Micron Technology has announced sample availability of its CZ120 memory expansion modules to customers and partners.

Backend houses will see their output for AMD's new AI chips increase significantly in 2024, according to industry sources.

Wistron's board of directors recently approved a company plan to inject an additional US$24.5 million into its manufacturing site in Vietnam.

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...

AMD CEO Lisa Su's Asia tour in July to secure its supply chain became the focal point for analysts during the company's 2Q23 financial earnings call. In particular, discussions on...

Component suppliers encountered a lackluster increase in orders from general-purpose server customers in the first half of 2023; however, orders are anticipated to increase in the...

Iteq, which specializes in high-speed and high-frequency copper-clad laminates (CCL), remains optimistic about demand for high-end automotive electronics and believes its deployment...

TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...

AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...

AMD posted declining sales and turned to operational loss in the past quarter. The second-largest PC processor provider expected PC inventories to normalize in coming quarters and...

AMD has announced plans to invest approximately US$400 million in India over the next five years. The planned investment consists of a new AMD campus in Bangalore, Karnataka that...