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Saturday 17 October 2026
Interview: SEMI CEO sees US$3 trillion chip industry by 2035, as trusted partners reshape supply chain
The semiconductor industry reached the US$1 trillion revenue milestone several years earlier than originally forecast, and with growth driven by AI and quantum computing, reaching...
Friday 16 October 2026
FICG eyes 4x optical communications capacity by 2027
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity...
Friday 16 October 2026
Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue
Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...
Friday 16 October 2026
US chipmakers rely more on overseas production than supplier data suggests, SIA finds
The US semiconductor industry sources 95% of its roughly US$27 billion in annual equipment and materials purchases from companies headquartered in the US, Europe and Japan. However,...
Friday 16 October 2026
Analysis: TSMC's chipmaking edge strengthens C.C. Wei's hand — from advanced-node capacity to Musk's Terafab
TSMC reported record earnings for the third quarter of 2026 and forecast a further 15% increase in fourth-quarter revenue, putting full-year US dollar revenue growth on course to reach...
Friday 16 October 2026
Thunder Tiger debuts new loitering munition drone at AUSA 2026
Thunder Tiger showcased its latest defense systems at AUSA 2026, the Association of the United States Army's annual exhibition in the US, marking its fourth consecutive appearance...
Thursday 15 October 2026
EU seeks China deal to lift ASML supplier sanctions amid rare-earth crisis
The European Union (EU) is negotiating with China to lift sanctions on Sindlhauser Materials GmbH, a small German business that is part of ASML's supply chain, according to people...
Thursday 15 October 2026
FIC Group opens Malaysia plant as optical module capacity targets 18 SMT lines
FIC Group opened its PRO3C (Malaysia) Sdn. Bhd. manufacturing facility in Johor, Malaysia, on October 15, expanding its optical communications production footprint in Southeast Asia...
Thursday 15 October 2026
US AI data center power shortages drive demand for hybrid solar, natural gas and geothermal systems
The rapid expansion of AI data centers in the US is placing growing pressure on conventional power grids, as their substantial and highly variable electricity requirements strain available...
Thursday 15 October 2026
South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance
South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary...
Thursday 15 October 2026
LEO satellite boom strains supply chain amid AI data-center demand
The global race to build low Earth orbit (LEO) satellite constellations is intensifying, but the massive deployment requirements are straining the aerospace supply chain. As AI data...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Applied Materials targets AI-driven semiconductor equipment growth through 2030
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Thursday 15 October 2026
Topco eyes Idaho base as North American chip expansion accelerates
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Wednesday 14 October 2026
Memory bottlenecks drive HBM shift to 8-layer stacks
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...