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Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Taiwan's export boom shifts toward AI servers, raising concentration risks
Taiwan's export surge is increasingly tied to high-value AI servers and pricier memory chips, a shift with implications far beyond the island. As exports climb, the outlook underscores...
Wednesday 14 October 2026
KYEC, Nvidia eye Texas site for US AI chip testing plant
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early...
Wednesday 14 October 2026
Adani and Jabil plan 50:50 JV to make AI data center hardware in India
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
Wednesday 14 October 2026
CEATEC 2026 showcases physical AI, smart infrastructure
Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, bringing together 821 companies and organizations from Japan and overseas to...
Wednesday 14 October 2026
Yaskawa targets 2030 humanoid robot rollout as AI lifts forecast
Japan's Yaskawa Electric plans to launch humanoid robots within the next one to two years and expects AI-powered humanoid robots to enter widespread use around 2030. The company also...
Wednesday 14 October 2026
Qualcomm says edge AI faces power, cost, and scale hurdles
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Wednesday 14 October 2026
Samsung integrates AI into daily life as LG showcases smart factories, data-center cooling
Samsung Electronics and LG Electronics showcased their AI strategies at KES 2026 in South Korea, with Samsung focusing on smartphones, TVs, and home appliances while emphasizing an...
Wednesday 14 October 2026
Apple launches HomeView display, rebuilding home lineup around Siri AI
Apple is betting that its new Siri AI assistant can revive a business in which, according to Reuters, the company "has tinkered for a decade without major success." At its...
Wednesday 14 October 2026
MiTAC spotlights liquid cooling, open platforms for AI infrastructure
MiTAC Computing Technology featured a comprehensive suite of full-stack AI infrastructure at the Open Compute Project (OCP) Global Summit in San Jose, California, centered around the...
Wednesday 14 October 2026
SEMICON West makes three-year commitment to Phoenix, home to over US$200B in chip investment
SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas...
Wednesday 14 October 2026
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Wednesday 14 October 2026
Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit
Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing...
Wednesday 14 October 2026
NTT Data, Anthropic negotiate Japan data center with up to 500MW
NTT Data and Anthropic are in final-stage negotiations to develop a data center in Osaka, Japan, with power capacity of up to 500MW, according to Nikkei. The project would...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...