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    Wistron sees AI demand widening as Taiwan ODMs gain pricing power
    2min ago
    Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
    12min ago
    NEWS TAGGED BUSINESS
    Monday 3 August 2026
    FICG launches Singapore-Malaysia dual-core strategy
    FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
    Monday 3 August 2026
    Elevated Materials names Jay Wang as chief revenue officer
    Elevated Materials has appointed Jay Wang as chief revenue officer as the battery materials company seeks to speed commercialization and widen its global reach. The move could matter...
    Sunday 2 August 2026
    AWS chip business passes US$25 billion run rate; CEO Jassy says there is 'real chance' of selling Trainium outside AWS
    Amazon's custom silicon business has reached an annual revenue run rate of more than US$25 billion and is growing at triple-digit percentages yearly, CEO Andy Jassy said on the company's...
    Saturday 1 August 2026
    MediaTek eyes high-single-digit revenue growth, 20% ASIC share by 2027
    MediaTek held an investor conference on July 31, 2026, with CEO Rick Tsai reiterating that ASIC revenue will reach US$2 billion in 2026. He also said the total addressable market for...
    Friday 31 July 2026
    ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

    Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

    Friday 31 July 2026
    ByteDance merges Lark with Doubao after AI revenue hits US$4B run rate
    ByteDance is reorganising Doubao, Lark and Volcengine around a more unified enterprise AI strategy, combining product development, cloud commercialisation and workplace software as...
    Friday 31 July 2026
    TSMC reportedly develops EMIB-like packaging to counter Intel

    TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

    Friday 31 July 2026
    AUO names current CFO president as Frank Ko steps down

    AUO's board of directors on July 30 approved a change in senior management, appointing Chief Financial Officer Chang Po-Yi as the company's...

    Friday 31 July 2026
    Apple braces for "hundred-year flood" in component costs
    Apple's June quarter showed the strength of its core hardware business. Still, it also exposed a looming challenge: rising memory prices, tight supply of advanced chips, and heavier...
    Friday 31 July 2026
    Amazon's accelerating cloud growth reinforces AI investment case despite heavier spending outlook
    Amazon reported stronger-than-expected second-quarter results as accelerating growth at its cloud computing business underscored rising demand for artificial intelligence services...
    Friday 31 July 2026
    UMC raises capex to US$2B, eyes AI SiPh
    UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...
    Friday 31 July 2026
    Chang Wah sees broadening demand recovery and higher margins in 2Q26
    Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...
    Friday 31 July 2026
    Coretronic drone unit shifts to four fronts amid procurement delay
    Coretronic said its robotics subsidiary, Coretronic Intelligent Robotics (CIRC), is focusing on four development priorities as a large domestic government drone procurement plan remains...
    Thursday 30 July 2026
    ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
    ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...
    Thursday 30 July 2026
    South Korean suppliers win HBM4 tester orders from SK Hynix
    South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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