Revenue prospects for TSMC's ecosystem partners, particularly semiconductor equipment makers, remain upbeat this year despite the ongoing coronavirus outbreak, according to market...

IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...

Winbond Electronics, a maker of specialty DRAM and flash memory, swung to its first quarterly loss in 27 quarters.

Despite market observers' concern about China's coronavirus outbreak dampening consumer demand in the first quarter, Adata Technology chairman Simon Chen is still optimistic that...

Billings among North American manufacturers of semiconductor production equipment came to US$2.49 billion in December 2019, reaching a 19-month high, according to SEMI.

Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...

Taiwan-based IC substrate makers Unimcron, Na Ya PCB and Kinsus Interconnect Technology are actively proceeding with capacity expansions for ABF substrates in 2020 to meet robust...

With TSMC - the world's top pure-play foundry - anticipating record-high capex levels this year, semiconductor equipment vendors particularly those engaged in TSMC's supply chain...

TSMC expects to post revenues of between US$10.2 billion and US$10.3 billion in the first quarter of 2020, representing an about 1.4% sequential decrease. Gross margin and operation...

Flexible PCB specialist Flexium Interconnect has set aside a capex of NT$6.7 billion (US$260 million) for 2020, more than double the figure of NT$3 billion for 2019, aiming to strengthen...

Taiwan-based hinge makers including Shin Zu Shing (SZS) and Jarllytec both will spend more to expand their production capacities this year, according to the companies.

Backend house Powertech Technology (PTI) expects its revenues to be higher than year-ago levels in the first quarter of 2020, and is positive about its performance in all of the ye...

DRAM chipmaker Nanya Technology has developed 10nm process technology in-house, with risk production to kick off in the second half of 2020, according to the Taiwan-based company.

IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...

Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...

Taiwan-based niche-type CCL maker Ventec International expects its gross margin to reach over 25% for whole-year 2019 thanks to volume production of its new high-end materials and...

Light guide plate (LGP) maker Global Lighting Technologies (GLT) has returned to the glowing keyboard supply chain of MacBook Pro and is set to add two production lines at its plant...

Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...

Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments...

The memory sector is expected to resume growth momentum in 2020 thanks to steady increase in demand for 5G and server applications, with DRAM and NAND flash to see supply shortfalls...

TSMC Nanjing Company has reported its first quarterly profit for the third quarter, which narrowed its losses to NT$1.41 billion (US$46.1 million) in the first three quarters of 2019...

Taiwan-based clean room engineering specialist Acter is expected to see its revenues pick up steadily in 2020 as major clients in Taiwan and China will boost capex to step up major...

Taiwan-based semiconductor equipment suppliers Gudeng Precision and Marketech International are expected to enjoy bright shipment prospect for 2020 as they have joined the supply...

FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...