ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...

Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...

TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...

Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments...

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...

Pegatron will not rule out setting up new factory sites in Vietnam and India to satisfy customer demand, according to company president and CEO SJ Liao.

The share of semiconductor industry capital spending held by the top-5 companies (Samsung, Intel, TSMC, SK Hynix and Micron) is forecast to reach an all-time high of 68% this year,...

Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...

Some flat panel makers in Korea and Taiwan, notably LG Display, AU Optronics (AUO) and Innolux, are cutting their capex for 2019 as they seek to improve their bottom lines in the...

Samsung Electronics is reportedly looking to place new equipment orders for its memory fabs in Pyeongtaek (South Korea) and Xian (China), gearing up to resume its aggressive capacity...

Vanguard International Semiconductor (VIS) remains cautious about its outlook for the rest of 2019, citing still high inventory levels at its customers, according to the Taiwan-based...

IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...

ABF substrate demand will stay robust throughout 2020 and beyond thanks to a diversity of applications arising with the advent of the 5G era, according to Jiang Xugao, a PCB expert...

Taiwan-based Gudeng Precision and Marketech International, which provide ASML equipment parts and components, are being identified as some of the beneficiaries of TSMC's capex ramp-up...

TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...

TSMC expects to enjoy another quarter of record high revenues, while adding an additional US$4 billion in its full-year capital budget. The pure-play foundry has forecast revenues...

Intel CEO Bob Swan is in Taiwan meeting with the chip vendor's supply chain partners, tightening relationships and talking about future development directions.

Contract prices for DRAM held flat in August 2019, with prices for 8GB PC DRAM modules averaging US$25.50, according to DRAMeXchange.

TSMC has advised its clients to book foundry capacity well in advance for their 7nm chip demand for the entire 2020, according to industry sources.

The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next year, according to market...

TSMC expects it 2019 capex to exceed the high end of its previous guidance range of US$10 billion to US$11 billion, as the pure-play foundry steps up efforts to expand its 7nm process...

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see its capex this year reach around US$12.5 billion to satisfy robust chip demand in the 5G era, according to industry...

Unimicron Technology has maintained its huge capex budgets for 2019 and 2020 are meant to strengthen its IC substrates technology upgrades and production capacity for the emerging...

Micron Technology is already engaged in risk production of DRAM chips built using 1z-nanometer process technology at its Hiroshima fab in Japan, according to the US memory chip vendor...

PCB and IC substrate supplier Unimicron Technology has set aside a capex of approximately NT$16.2 billion (US$514.5 million) for 2020, up from NT$9.2 billion for 2019, to strengthen...