中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    First Solar withdraws 337 case, shifts TOPCon patent fight
    3min ago
    Z.ai's ZCode crisis exposes AI coding's enterprise trust gap
    30min ago
    TSMC builds Kaohsiung hub to speed advanced packaging tests
    30min ago
    Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
    34min ago
    SK Hynix pushes deeper into logic for next-generation 3D DRAM
    52min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 13 February 2026
    Samsung's non-memory unit to turn profitable in 4Q26 as Exynos 2700 targets 50% share in Galaxy S27
    Industry analysts indicate that Samsung Electronics' non-memory division is expected to return to profitability in the fourth quarter of 2026, with a full-year turnaround projected...
    Friday 13 February 2026
    TSMC and memory makers boost capex to offset China export restrictions impact
    TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
    Friday 13 February 2026
    New Taiwan–US trade pact lowers export barriers, boosts tech supply chains
    The Agreement on Reciprocal Trade (ART) between Taiwan and the US has been officially signed, reducing Taiwan's average export tariffs to the US by 23.45pp and boosting export competitiveness...
    Friday 13 February 2026
    SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race
    SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
    Friday 13 February 2026
    Display makers exit old LCD plants as chipmakers hunt cleanrooms
    Due to low production efficiency and intense price competition, major panel makers like AUO, Innolux, and LG Display are selling older LCD factories. Semiconductor companies such as...
    Friday 13 February 2026
    Naura rises to No. 5 in global semiconductor equipment rankings

    China's semiconductor equipment makers are advancing rapidly even as the global chip supply chain undergoes restructuring and geopolitical...

    Friday 13 February 2026
    SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
    SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...
    Friday 13 February 2026
    Air cooling will dominate Trainium 3 rollout as Amazon targets 2Q26 production ramp
    Amazon Web Services' (AWS) Trainium 3 servers, slated for mass production in the second quarter of 2026, have sharply reduced their planned use of liquid cooling, supply chain sources...
    Friday 13 February 2026
    Commentary: NSTC chief’s reform remarks ignite debate over Taiwan’s research metrics
    Minister of the National Science and Technology Council (NSTC) Cheng-wen Wu has recently sparked a firestorm across Taiwan's academic community. His blunt critique of long-standing...
    Friday 13 February 2026
    Applied beats as AI chip spending nears $1tn tipping point
    On February 12, Applied Materials Inc. (AMAT) announced fiscal first-quarter 2026 financial results that exceeded the midpoint of its previous guidance, driven by a significant surge...
    Friday 13 February 2026
    Why Applied says the AI boom is real—just waiting for more cleanrooms
    Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
    Friday 13 February 2026
    Samsung said to gain 8nm orders in Europe as 2nm plan advances

    Samsung Electronics is said to be expanding its 8nm foundry customer base into Europe following earlier contract wins in the US and Ja...

    Friday 13 February 2026
    A tariff truce with teeth: US–Taiwan pact shields chips from Section 232 shocks
    US Ambassador Jamieson Greer oversaw the signing of a comprehensive Agreement on Reciprocal Trade between the US and Taiwan on February 12, 2026. The agreement, reached under the auspices...
    Friday 13 February 2026
    E-glass capacity cuts trigger production shifts for Taiwan CCL makers
    The global AI data center boom is straining not only high-end computing chips but also adjacent industries such as memory and upstream glass fiber cloth, where significant capacity...
    Friday 13 February 2026
    Winbond's two-year sell-out signals memory cycle shift and US$1.35bn capex push

    Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond...

    289/442 pages
    biz
    BIZ FOCUS
    Sep 21, 08:00
    GMIF 2026 Agenda Unveiled: Tech Giants on Lineup
    Monday 21 September 2026
    Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026
    Friday 18 September 2026
    SK hynix Launches 'SK hynix Ventures' in Silicon Valley
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    reportAIglasses