Broadcom has partnered with Apollo Global Management and Blackstone's Credit & Insurance business to launch the AI XPV Platform, a new financing vehicle backed by an initial US$35...
YMTC and CXMT have returned to Washington's Chinese Military Companies list, placing China's two leading memory chipmakers back at the center of US scrutiny over semiconductors, military-civil...
QBit Semiconductor said it will buy a 60% stake in Singapore-based Sinchip Technology, a move that gives it control of the company and expands its reach across major chip markets....
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup...
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tencent is sharpening a dual-track AI chip strategy, combining self-developed semiconductors for its own business workloads with deeper partnerships across China's domestic AI computing...
Automotive power and safety parts manufacturer Global PMX said it secured placements in the supply chains of leading AI chip and rack makers and expected a wave of high-margin liquid-cooling...
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after...
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue...
Shanghai Belling, a Chinese analog IC supplier, has announced price adjustments for some of its products starting June 9, 2026, with increases ranging from 10% to 30%. The move is...
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
