中文網
Taipei
Sun, Oct 17, 2021
09:05
rain
22°C
CONNECT WITH US
NEWS TAGGED CSP
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Thursday 5 August 2021
Nuvoton sees merger with PSCS start paying off
MCU specialist Nuvoton Technology has seen the synergies from its 2019 acquisition of Panasonic Semiconductor Solutions (PSCS) start paying off, given its sharp revenue and profit...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Monday 14 December 2020
All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top management shakeup after...
Thursday 19 November 2020
Harvatek intros CSP LED product with flip chip technology
Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces...
Thursday 29 October 2020
Fire strikes Unimicron IC substrate plant in northern Taiwan
Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
Tuesday 18 August 2020
ASE breaks ground for new advanced packaging fab in Taiwan
ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...
Thursday 30 April 2020
China Wafer Level CSP sees huge on-year growth in 1Q20 business
China-based CIS (CMOS image sensor) packaging service provider China Wafer Level CSP has posted consolidated revenues of CNY191 million (US$27.4 million) and net profit of CNY62 million...
Tuesday 24 March 2020
CIS backend specialists expanding capacity
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
Monday 10 February 2020
Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the market, Taiwan's...
Monday 28 January 2019
Unimicron raises capex budget for 2019
PCB and IC substrate supplier Unimicron Technology has decided to increase its capex budget this year by NT$2.32 billion (US$75.5 million) to total NT$8.3 billion, according to a...
Tuesday 16 January 2018
Xintec to see orders for 3D sensing from iPhone and Android camps
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
Tuesday 4 July 2017
China LED industry recovering
As demand for LED end devices has resumed growth amid shortages of LED chip supply, China's LED makers have recently begun expanding their capacities and local governments are also...
Monday 22 May 2017
Epistar expects increases in CSP LED chip shipments for TV BLUs in 3Q17
LED epiwafer and chip maker Epistar expects shipments of CSP (chip-scale packaging) LED chips for LCD TV backlighting to increase beginning third-quarter 2017, according to the com...
Wednesday 29 March 2017
Xintec looks to turnaround in 2H17
Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...