SK Hynix has developed 6Gb low-power DDR3 (LPDDR3) using 20nm-class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, ideal for premium mobile devices, according to the chipmaker. Four 6Gb LPDDR3 chips can be stacked up and realize a high density of maximum 3GB solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to SK Hynix' 4Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand, according to the vendor. The SK Hynix 6Gb LPDDR3 works at 1866Mbps, and with a 32-bit I/O it processes up to 7.4GB of data per second in a single channel, and 14.8GB in a dual channel. It can be provided in a form of package-on-package (PoP) to mobile devices.

Apple has showed a sneak peek into the future of the pro desktop with a first look at the next-generation Mac Pro. Designed around a unified thermal core, the Mac Pro introduces a new pro desktop architecture and design that is optimized for performance. The new 9.9-inch tall Mac Pro features next-generation Xeon processors, dual workstation-class GPUs, Thunderbolt 2, PCIe-based flash storage, and ECC memory. The next-generation Mac Pro is architected around a unified thermal core that allows the desktop to efficiently share its entire thermal capacity across all the processors. Next generation Intel Xeon E5 processors with up to 12 core configurations deliver double the floating point performance. With two AMD FirePro workstation-class GPUs, the all-new Mac Pro is up to 2.5 times faster than the current Mac Pro and delivers up to seven teraflops of compute power. The new Mac Pro also features PCIe-based flash storage that is up to 10 times faster than conventional desktop hard drives and includes the latest four-channel ECC DDR3 memory running at 1866 MHz to deliver up to 60GBps of memory bandwidth.

SK Hynix has developed 20nm-class 4Gb(gigabit) graphics DDR3 DRAM, designed for notebooks requiring low-power consumption. The new 4Gb GDDR3, built using Hynix' 20nm-class technology, runs at 1.35V - 30% less power than the previous 30nm-class 1.5V product. Operating at low-voltage levels, the new chip delivers desktop-level graphics performance. The new Hynix 4Gb GDDR3 also operates at the speed of 1.8Gbps and processes up to 3.6GB of data per second with a 16-bit I/O. Hynix is scheduled to enter mass production of its 20nm-class 4Gb GDDR3 chips in the fourth quarter of 2012.