中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Why Shanghai is becoming China’s center for lithography
    5h 2min ago
    Beijing’s AI hub takes shape as Moonshot and Z.ai vie for talent and capital
    5h 2min ago
    Beyond compute: how memory and storage became the next contested field of automotive semiconductors
    5h 2min ago
    German joint ventures in China fell below 50% utilization as car market restructuring intensified
    5h 2min ago
    Research Insight: What CXMT IPO signals amid DRAM industry shift
    5h 2min ago
    NEWS TAGGED DEVELOPMENT
    Wednesday 22 July 2026
    US-China AI rivalry, part 1: September talks to confront frontier models, IP theft, open-source risks

    The US and China are preparing to hold their first official artificial intelligence (AI) dialogue under President Donald Trump, a notable...

    Wednesday 22 July 2026
    Albany NanoTech Complex acquires ASML High NA EUV tools for chip research
    Parts of ASML's next-generation high numerical aperture (High NA) extreme ultraviolet (EUV) machine have arrived in New York state, where they will be used for chipmaking R&D....
    Wednesday 22 July 2026
    Siemens to acquire Precision Innovations for AI-powered chip planning
    Siemens said it has agreed to buy Precision Innovations in a deal that would add AI-powered chip planning tools to its electronic design automation business. The move could affect...
    Wednesday 22 July 2026
    Intel and Fortinet deepen collaboration on new security processor

    Intel and Fortinet have expanded their long-standing partnership to develop the Fortinet Security Processor 6 (SP6), a move expected...

    Wednesday 22 July 2026
    Kimi K3 sparks new 'DeepSeek moment,' reshaping AI's winners and losers
    Chinese artificial intelligence (AI) startup Moonshot AI launched its next-generation Kimi K3 model on July 17, delivering performance comparable with leading models from OpenAI and...
    Wednesday 22 July 2026
    Samsung disputes report of V10 NAND shipments to Nvidia
    Samsung Electronics has disputed a report that it had begun supplying its 10th-generation V-NAND to Nvidia and was preparing to expand production ahead of the US chipmaker's CMX storage...
    Wednesday 22 July 2026
    OpenAI chair says enterprise AI will shift from token costs to outcomes
    OpenAI Chair Bret Taylor said businesses will soon stop closely tracking token costs as artificial intelligence spending management becomes more automated. Speaking to CNBC,...
    Wednesday 22 July 2026
    Tesla's EV platform powers Optimus scale production edge
    Tesla's humanoid robot Optimus is set to begin mass production at the end of July, according to supply chain sources. Tesla previously retooled an electric vehicle production line...
    Wednesday 22 July 2026
    Japan weighs new standards post to gain an edge in AI and chips
    Japan is considering creating a senior government position to coordinate international standardization across ministries and industry, as Tokyo seeks to convert a sweeping investment...
    Wednesday 22 July 2026
    GLT helps Smobio Technology scale biotech materials for global orders

    Smobio Technology, a strategic investment of Global Lighting Technologies (GLT), will officially list on Taiwan's Emerging Stock Board...

    Wednesday 22 July 2026
    Academia Sinica quantum chip platform targets production by end of 2026
    Academia Sinica said its quantum chip fabrication platform in Tainan is moving through equipment calibration and is expected to start producing quantum chips by the end of 2026. The...
    Wednesday 22 July 2026
    Ablecom expands Taoyuan capacity to meet rising AI server rack demand
    Ablecom Technology said it is expanding production capacity in Taoyuan, Taiwan, as demand grows for AI high-density compute and hyperscale data center buildouts. The chassis and advanced...
    Tuesday 21 July 2026
    Li Auto reportedly forms new Shanghai chip company to expand in-house semiconductor ambitions
    Chinese electric vehicle (EV) maker Li Auto has established a new subsidiary focused on IC chip design, underscoring its long-term strategy of developing core AI technologies in-ho...
    Tuesday 21 July 2026
    BOE expands into glass-core packaging, solar cells and optical interconnects
    BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
    Tuesday 21 July 2026
    Taiwan lawmakers stall on drone procurement bill as localization debate intensifies

    Taiwan's Legislative Yuan reviewed four versions of a special bill for drone procurement on the 16th but reached no conclusion, leaving...

    5/99 pages
    Research Report Database
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
    AI Summit Seoul