News tagged DIGITIMES at DIGITIMES

NEWS TAGGED DIGITIMES

Wednesday 16 September 2026

DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend...

Wednesday 16 September 2026

DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

Wednesday 16 September 2026

Charts: Memory has held six of the ten fastest-growing spots in Taiwan's chip sector for seven straight months

Of the 94 listed Taiwanese semiconductor companies DIGITIMES tracks, 80 grew year-over-year in August 2026 and 14 declined. Median year-over-year...

Wednesday 16 September 2026

DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

Tuesday 15 September 2026

DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting

DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.

Tuesday 15 September 2026

Inside CIOE: takeaways from China's biggest optoelectronics show

Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...

Monday 14 September 2026

DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker

ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...

Saturday 12 September 2026

Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware

King Slide Works posted the fastest revenue growth in August among the 50 Taiwan-listed AI supply chain companies tracked by DIGITIMES, with sales up 318% from a year earlier...

Wednesday 9 September 2026

CSPs expand Malaysia AI server hubs as Southeast Asia grows

According to the latest DIGITIMES Intelligence report, US-based cloud service providers (CSPs) are expanding their footprint in Malaysia, with Microsoft and Google driving the next...

Tuesday 8 September 2026

What to expect at CIOE 2026, Shenzhen's optoelectronics mega-expo

This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's...

Monday 7 September 2026

Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...

Monday 7 September 2026

Exclusive: Infineon COO says chip shortage recovery will take longer

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...

Monday 7 September 2026

Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes

The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective...

Sunday 6 September 2026

K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors

The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that...

Sunday 6 September 2026

Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem

In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...

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