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    Commentary: Samsung’s Taylor 2nm ramp-up is critical to closing the gap with TSMC
    50min ago
    Global auto downturn creates risks and opportunities for Taiwan suppliers
    50min ago
    Chip inflation accelerates smartphone brands’ retreat from low-end devices
    50min ago
    Analysis: What China's proposed export controls for AI foundation models and agents means
    50min ago
    Analysis:Why has China expanded export control to AI chip design and computing technologies now
    51min ago
    NEWS TAGGED DRAM
    Thursday 15 October 2026
    Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
    Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
    Thursday 15 October 2026
    Applied Materials targets AI-driven semiconductor equipment growth through 2030
    Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

    The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...

    Wednesday 14 October 2026
    SK Hynix HBM4 equipment installations reportedly face partial deferral to 2027
    Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
    Wednesday 14 October 2026
    Elon Musk says Micron is 'reasonable' on memory prices while others are 'extortionate'
    Elon Musk has criticized memory chip suppliers for charging what he called "extortionate" prices while praising Micron Technology's approach to future pricing, highlighting tensions...
    Wednesday 14 October 2026
    HBM capacity shift sends DDR4 contract prices rising faster than DDR5
    DDR4 contract prices are rising faster than those of the newer DDR5 standard, reversing the usual pricing pattern in the memory market. The artificial intelligence (AI) boom has prompted...
    Wednesday 14 October 2026
    CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
    China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
    Wednesday 14 October 2026
    Qualcomm says edge AI faces power, cost, and scale hurdles
    Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
    Wednesday 14 October 2026
    AI memory boom pushes smartphone market into premium-first reset
    While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory...
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, Sandisk, BIWIN, and Others Honored

    The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel, co-hosted by the Shenzhen Memory...

    Tuesday 13 October 2026
    CXMT's server DRAM push raises margin concerns for Samsung, SK Hynix
    China's ChangXin Memory Technologies (CXMT) is raising concerns over the future pricing power of Samsung Electronics, SK Hynix, and Micron as its plans for next-generation server DRAM...
    Tuesday 13 October 2026
    Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
    After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
    Monday 12 October 2026
    Nanya gross margin hits 85.7% as low-priced DRAM contracts roll off
    Nanya Technology reported record quarterly earnings in the third quarter of 2026, according to unaudited results released on October 12, as DRAM average selling prices (ASPs) rose...
    Monday 12 October 2026
    Samsung could unseat SK Hynix as HBM leader in 2027
    Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited...
    Monday 12 October 2026
    CXMT targets 2026 debut of 4F² DDR5 RDIMM in bid to challenge server DRAM rivals

    China's ChangXin Memory Technologies (CXMT) plans to introduce DDR5 registered DIMMs (RDIMMs) based on its new 4F² DRAM architecture by the...

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    BIZ FOCUS
    Oct 19, 08:00
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
    Monday 19 October 2026
    Breaking free from keyword constraints: How GeoGraph elevates job matching
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI