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Monday 20 July 2026
BYD targets Japan's Kei-car stronghold with low-cost EV challenge
BYD is pressing ahead with plans to enter Japan's all-electric kei-car market, stepping up promotional activity and appointing a brand ambassador in a sign of growing confidence about...
Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Monday 20 July 2026
MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference...
Saturday 18 July 2026
Column: South Korea's semiconductor strategy faces foresight and structural gaps
South Korea's technology policies—including the two semiconductor strategies discussed previously and the broader K-Moonshot initiative introduced more recently—have been...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
Dutch report frames Chinese interference in chips, ports and aerospace as a systemic threat
Chinese foreign interference in the Netherlands' strategic industries should be treated as a systemic, long-term threat rather than a series of isolated incidents, according to "Beyond...
Saturday 18 July 2026
TCL starts OLED monitor panel production ahead of Guangzhou fab opening
TCL CSOT has started producing a 27-inch inkjet-printed OLED monitor panel at its Gen 5.5 line in Wuhan, giving the Chinese display maker an early foothold in consumer OLED monitors...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
Saturday 18 July 2026
China's AI sector pivots to system-level "super-nodes" as chip curbs bite at WAIC 2026
The largest World Artificial Intelligence Conference (WAIC) to date opened in Shanghai on July 17, and its dominant signal was strategic: China's answer to US limits on advanced chips...
Friday 17 July 2026
Japan's ACSL eyes Taiwan drone supply chain expansion, commits to TADTE 2027
Japanese industrial drone maker ACSL is open to expanding procurement from Taiwan as it strengthens its international supply chain strategy, with the company accepting an invitation...
Friday 17 July 2026
Taiwan drone sector expands Japanese tie-ups

Taiwan's drone industry has grown rapidly in recent years, with output surging from about NT$5 billion (US$154.87 million) in 2024...

Friday 17 July 2026
China unveils first official commercial space roster, backing established players and the NTN ecosystem

An organization under China's State Administration of Science, Technology and Industry for National Defense (SASTIND) released the...

Friday 17 July 2026
Taiwan-Japan AI tech forum seeks closer partnerships

A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives...

Friday 17 July 2026
China, Netherlands urge Nexperia talks as Wingtech warns of 1H loss

China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia...

Friday 17 July 2026
WAIC 2026 puts China's AI race on supernodes, domestic chips, and real-world deployment

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed...