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    Nvidia's US$13 billion Hugging Face deal bets physical AI can start at US$400, not US$40,000
    1min ago
    Oracle's AI cloud build-out is now rewriting its cost structure
    1min ago
    Oracle turns its AI build-out into a delivery number, and the cost lands where management said it would
    1min ago
    AI server tracker: Taiwan's August filings say demand is still accelerating
    5min ago
    iPhone Duo leads Apple's new lineup as market stays split
    10min ago
    MediaTek August revenue beats expectations, boosts 3Q outlook
    22min ago
    Apple's foldable arrives late to a supply chain already moving on
    50min ago
    China moves to rein in booming energy storage and lithium battery overcapacity
    Sep 10, 18:52
    Taiwan's govt delegation visit Europe, strenthening advanced packaging and SiPh ties
    Sep 10, 18:51
    How Huawei, Xiaomi and Apple diverge in foldable phones
    Sep 10, 18:51
    Global drone supply chains accelerate decoupling from China, Taiwan sees an opening
    Sep 10, 18:51
    NEWS TAGGED EAST ASIA
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
    Thursday 10 September 2026
    Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

    Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

    Thursday 10 September 2026
    DeepSeek's next AI test is not the model; it's everything around it

    DeepSeek has opened roughly 150 positions in a new hiring round focused almost entirely on engineering and infrastructure, pointing to...

    Thursday 10 September 2026
    Phison pushes in-house AI solutions as August revenue surges to record high
    Phison Electronics continues to benefit from the rapid growth in demand for artificial intelligence (AI) infrastructure, AI inference, and enterprise storage, with its Phison AI Data...
    Thursday 10 September 2026
    Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
    AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
    Thursday 10 September 2026
    JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
    JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
    South Korea's science ministry has budgeted KRW250 billion (US$184.6 million) for 2027 to run "AI for all," a state-funded program that aims to give every citizen free access to chatbots...
    Thursday 10 September 2026
    China gets an early shot at the next SiC power-chip cycle

    Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

    Thursday 10 September 2026
    Beyond the stage, can XPeng's EV playbook scale humanoid robots?
    As humanoid robotics glides — in its own distinctive glamour — toward becoming one of the most visible manifestations of physical AI, the once-unimaginable idea of where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
    The appeal of lithium-manganese-rich (LMR) batteries has long rested on a difficult proposition: delivering relatively high energy density without carrying the same material costs...
    Thursday 10 September 2026
    CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

    China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

    Thursday 10 September 2026
    China's 6G race starts before the first 6G phone as satellite links move into the network core

    China's next-generation communications push is beginning to reveal a broader ambition than simply putting faster wireless connections...

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    BIZ FOCUS
    Sep 10, 08:00
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
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