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Monday 27 October 2025
Nexperia dispute threatens legacy chips critical to basic car functions for automakers worldwide
The largest US auto-parts trade group has warned that domestic carmakers may see major production disruptions within two to four weeks, as the escalating dispute over Nexperia risks...
Monday 27 October 2025
Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
Below are the top DIGITIMES Asia stories from October 20 to 26, 2025.
Monday 27 October 2025
Nexperia export ban rattles carmakers from Seoul

China's recent order banning exports from the Chinese factories of Dutch semiconductor firm Nexperia has sent shockwaves through the...

Monday 27 October 2025
China's semiconductor reckoning: YMTC chairman on 5 shifts that will redefine sector
As China gears up for its Fifteenth Five-Year Plan, Chen Nanxiang, chairman of the China Semiconductor Industry Association (CSIA) and YMTC, said the country's semiconductor industry...
Monday 27 October 2025
Taiwan turns China's export curbs into a test of industrial resilience

As Energy Taiwan and Net-Zero Taiwan 2025 open on October 29, Beijing has completed its second wave of export restrictions on lithium...

Monday 27 October 2025
Samsung launches aggressive price-cut strategy to catch up in HBM competition
HBM continues to be a critical resource as the AI boom is further tightening supply and demand in the memory industry. Memory leader Samsung Electronics is fixated on reclaiming its...
Monday 27 October 2025
As Huawei stumbles, ByteDance quietly rewrites China’s AI cloud order
Huawei Cloud CEO Zhang Ping'an and several top executives were recently demoted and had their salaries reduced, officially due to "performance falsification." The punishment, however,...
Sunday 26 October 2025
LGES approaches China's battery market with time compression, accumulation strategy
In the face of policy and capital competition pressure from Chinese companies, LG Energy Solution (LGES) is implementing a strategy that combines time compression and accumulation...
Sunday 26 October 2025
CXMT, Huawei align on HBM3 ahead of China's 2026 AI memory leap
High-bandwidth memory (HBM) has become the latest competitive front for global DRAM manufacturers. As Samsung, SK Hynix, and Micron gear up for HBM4 mass production in 2026, China's...
Saturday 25 October 2025
OpenAI, AMD, Broadcom unite behind Ethernet to reshape AI infrastructure
The Ethernet for Scale-Up Networking (ESUN) Alliance officially launched at the 2025 Open Compute Project (OCP) Global Summit, uniting North America's AI heavyweights, including OpenAI,...
Friday 24 October 2025
Korean firm wins top innovation award for transparent 5G/6G antenna technology
Automotive electronics manufacturer THN grabbed a Top Innovation Technology Award here on October 23 at the Future Innovation Technology Expo (FIX 2025) for its breakthrough transparent...
Thursday 23 October 2025
Samsung expresses confidence in 2nm development, reports solid progress
Samsung Electronics' Device Solutions (DS) division CTO Song Jae-hyuk expressed strong confidence in the revival of Samsung's foundry business and reported smooth progress on the...
Thursday 23 October 2025
SEDEX 2025: Samsung debuts HBM4; SK Hynix showcases rival design
Samsung Electronics and SK Hynix unveiled their next-generation high-bandwidth memory (HBM4) at SEDEX 2025 in South Korea, marking Samsung's first public display of an HBM4 sample...
Thursday 23 October 2025
Analysis: China's EV market awaits BMW's Neue Klasse in 2026
BMW's all-new iX3 — the first SUV on its Neue Klasse electric platform — is drawing strong early blind orders in Germany. But the model's fate will be decided in China,...
Thursday 23 October 2025
Samsung set to roll out Ballie AI robot in Vietnam with launch imminent
Samsung Electronics is reportedly set to start production of its AI-powered home assistant robot, Ballie, at its facility in Ho Chi Minh City, Vietnam, suggesting that the long-delayed...