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Tuesday 16 July 2024
TEL unveils open-source GenAI SSA at Semicon West 2024
Semicon West 2024 was held on July 9-11 in San Francisco, and Tokyo Electron Limited (TEL), the Japanese semiconductor equipment supplier, unveiled the world's first open-source generative...
Tuesday 16 July 2024
Samsung subsidiary Semes eyes HBM market with advanced TCB amid competition
As the market for Thermo Compression Bonding (TCB) equipment diversifies, Semes, a subsidiary of Samsung Electronics and South Korea's leading semiconductor equipment manufacturer,...
Tuesday 16 July 2024
India-based Cyient sets up subsidiary focusing on ASICs
According to Business Standard and Financial Express, India-based Cyient is expanding its semiconductor business by creating a new subsidiary. This subsidiary will...
Friday 12 July 2024
Taiwan fab toolmakers grab major orders from TSMC and China
Taiwan-based semiconductor equipment manufacturers are increasingly involved in the supply chains of TSMC and Chinese foundries, according to industry sources. SEMI projects global...
Wednesday 10 July 2024
Screen targets doubling sales in a decade with expanded R&D and capital expenditure plans
Screen unveils its three-year mid-term business plan, aiming to increase its overseas R&D spending to address advancements in semiconductor process miniaturization, while also...
Wednesday 10 July 2024
Samsung and SK Hynix set to introduce new HBM wafer debonding technology
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
Wednesday 10 July 2024
Chinese and South Korean SiC tool makers make efforts to cut dependence on Aixtron
In the 2024 SiC Semiconductor Conference held in Pusan in late June 2024, Chinese and South Korean fab tool makers announced SiC MOCVD-related technologies, trying to challenge the...
Wednesday 10 July 2024
Semiconductor manufacturing equipment growth to set new high in 2025: SEMI
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4%...
Wednesday 10 July 2024
Singapore to balance data center growth and sustainability in green initiative
Amidst the surge in demand for data centers, Singapore unveiled its Green Data Center Roadmap in May to promote sustainable practices in the industry. This ambitious plan aims to...
Wednesday 10 July 2024
Taiwan AI server export value grows significantly
According to customs export figures released on July 9 by the Ministry of Finance, in June 2024, the export value of ICT and audiovisual products reached US$10.7 billion, marking...
Monday 8 July 2024
Japan-based Horiba to establish semiconductor measuring equipment facility in western India
According to Business Standard, Japan-based Horiba, a major player in the global semiconductor industry, plans to establish a manufacturing facility in India. This plant...
Monday 8 July 2024
Japan revises upward semiconductor equipment sales forecast
The Semiconductor Equipment Association of Japan (SEAJ) has revised its forecast for fiscal 2024 (April 2024 to March 2025) sales of semiconductor equipment produced by Japan-based...
Friday 5 July 2024
China still relies heavily on Nvidia AI chips despite Huawei's best efforts
As the technological competition between China and the US intensifies, AI chips have become a crucial resource. The US government's export ban on Nvidia's high-end AI chips has prompted...
Friday 5 July 2024
South Korean 8-inch wafer foundry to engage in SiC and GaN business
South Korean 8-inch wafer foundries are accelerating their investments in next-gen power semiconductors. Facing fierce competition from established global manufacturers and Chinese...
Friday 5 July 2024
China plays down importance of lithography tools in semiconductor challenges
China seems to be deliberately playing down the importance of lithography tools as it identifies the challenges for the development of its semiconductor industry in a recently published...