The potential blacklisting of SMIC, China's largest pure-play foundry, by the US government may shake up the second-tier pure-play foundry market segment.

Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.

TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.

ASML has unveild its Global EUV Training Center in Tainan, southern Taiwan to serve its customers in Asia.

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

ASML has announced it will set up an EUV technology training center at Southern Taiwan Science Park (STSP), giving a boost to the EUV technology cluster headed by TSMC.

TSMC's Taiwan-based fab tool suppliers, including Foxsemicon Integrated Technology, Grand Process Technology (GPTC) and Gudeng Precision Industrial, all saw their revenues for July...

With TSMC scaling up its 7nm and 5nm chip output, related silicon wafer materials and equipment suppliers have seen significant orders from the pure-play foundry and are ramping up...

TSMC has developed what the company claims is the world's first environmental-friendly "dry-clean technique for EUV mask" to replace the traditional clean process.

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has disclosed net profits...

Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process...

KLA has announced the eSL10 e-beam patterned-wafer defect inspection system, which is designed to accelerate time-to-market for high-performance logic and memory chips, including...

China's state-backed SMIC has stepped up the development of its FinFET process technology, disclosing plans to roll out its FinFET N+1 and N+2 processes without implementing EUV li...

Equipment suppliers in the TSMC Grand Alliance will see their revenues for the second half of 2020 receive a significant boost as the foundry has recently announced raising its capex...

It remains to be seen whether unsatisfactory yield rates at Samsung Electronics' 5nm EUV process may affect the launch of Qualcomm's next-generation flagship 5G mobile chip series,...