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Thursday 16 April 2026
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark...
Thursday 16 April 2026
TSMC enters 2nm mass production, scales 3nm capacity
TSMC laid out its capacity expansion plans and advanced node progress at its first quarter 2026 earnings call. Chairman C.C. Wei reaffirmed Taiwan as the primary base for leading-edge...
Thursday 16 April 2026
YMTC to ramp Wuhan fab in 2026, new capacity unlikely before 2028, oversupply risks seen limited

China-based Yangtze Memory Technologies Corp (YMTC) is advancing an aggressive expansion plan that could become the world's third-largest...

Friday 10 April 2026
SK Hynix M15X reportedly ramps early production
SK Hynix's M15X is widely viewed as the company's next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output...
Thursday 9 April 2026
Samsung P4 fab nears completion, expanding 1c DRAM capacity
Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According...
Thursday 9 April 2026
ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab
Semiconductor startup ChipX is moving to commercialize silicon photonics and high-voltage power chip technologies for artificial intelligence (AI) data centers, as it advances plans...
Thursday 9 April 2026
China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
Global memory markets are entering a new restructuring cycle driven by AI demand, with China's YMTC and CXMT scaling capacity and state-backed investment to gain share in a sector...
Thursday 9 April 2026
Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as...
Thursday 9 April 2026
Zensemi strengthens automotive chip team with hiring of industry veterans KC Ang and Marco Maria Monti
China-based automotive semiconductor wafer foundry Zensemi has announced a new management team led by chairman Xiaofei Chen, appointing two internationally experienced executives:...
Thursday 2 April 2026
Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning...

Thursday 2 April 2026
Samsung upgrades Austin fab, signals dual-track US chip strategy
Samsung Electronics is accelerating the introduction of next-generation manufacturing equipment at its semiconductor facility in Austin, Texas, as part of a broad upgrade program aimed...
Thursday 2 April 2026
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies...
Thursday 2 April 2026
Intel buyback signals shift beyond austerity as chipmaker regains confidence
Intel's US$14.2 billion buyback of its Ireland fab stake signals a shift beyond austerity, reflecting improved finances, renewed confidence in AI-driven CPU demand, and a strategic...
Tuesday 31 March 2026
Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
Tuesday 31 March 2026
LCD monitor panel prices rose as notebook panel price drop slowed in March
Rising upstream costs and constrained fab capacity are driving increases in LCD monitor panel prices, with April hikes likely as display driver and timing-controller ICs gain. Tight...