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Tuesday 20 August 2024
Challenges ahead for Europe's first 12-inch wafer fab
Following investments in wafer fabs in the US and Japan, TSMC is scheduled to hold a groundbreaking ceremony for its wafer fab in Dresden, Germany, on August 20. The fab is expected...
Monday 19 August 2024
TSMC Japan fab forms industry cluster; can German site replicate?
With Intel and Wolfspeed delaying the development of facilities in Germany, TSMC will break ground on a new plant in Dresden on August 20, which is critical for Germany, according...
Thursday 15 August 2024
How ESMC project is cementing Taiwan's role in global chipmaking
Following the United States and Japan, TSMC's final overseas wafer fab, ESMC (European Semiconductor Manufacturing Company), will...
Thursday 8 August 2024
TSMC to break ground on German plant amid talent crunch
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
Friday 2 August 2024
Japan pursues semiconductor leadership with additional measures
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
Tuesday 30 July 2024
Infineon escalates legal battle against Innoscience over GaN patents
On July 23, 2024, Infineon Technologies AG expanded its ongoing lawsuit in the U.S. District Court for the Northern District of California, adding claims against Innoscience (Zhuhai)...
Monday 29 July 2024
EU subsidies for fab construction progressing slowly; both TSMC and Intel yet to be approved
In March and April 2024, the implementation unit of the US CHIPS and Science Act and the US Department of Commerce announced that Intel and TSMC received US$8.5 billion and US$6.6...
Monday 29 July 2024
Global automakers challenge Avanci over soaring 5G patent fees
A coalition of six major automotive industry associations from Europe, the US, Japan, South Korea, Germany, and France has publicly questioned Avanci's increasing fees for 5G wireless...
Monday 29 July 2024
Slow EU approval delays Intel and TSMC subsidies under European Chips Act
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
Thursday 25 July 2024
Slowing demand, policy changes limit EV adoption
Disappointing demand growth, uncertainties surrounding the upcoming US presidential election, and government policy changes have slowed the adoption of electric vehicles (EV), according...
Thursday 25 July 2024
TSMC to break ground for German fab at year-end 2024, sources say
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Thursday 25 July 2024
TSMC fab in Germany faces challenges for profitability
TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.
Wednesday 24 July 2024
Intel Foundry faces hurdles in European expansion and performance struggles
Intel has confirmed that part of its European investment project has been shelved due to economic reasons, highlighting the chipmaker's challenges in its foundry business, which relies...
Friday 12 July 2024
German EV sales surge despite subsidy cuts, raises market optimism
According to statistics from the Federal Motor Transport Authority (Kraftfahrt-Bundesamt, KBA) in Germany, 43,000 new pure electric vehicles were registered in June, achieving a market...
Thursday 4 July 2024
TSMC-Saxony Semiconductor Talent Program shows successful results
The "2024 Semiconductor Talent Development Program," a joint effort of the German government of Saxony, National Taiwan University, and TSMC, has born the first batch of fruits.
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