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NEWS TAGGED HPC
Monday 6 June 2022
Taiwanese cooling module makers turn to making VCs for HPC
Cooling module maker Auras Technology and Nidec Chaun-Choung Technology (CCI) are both turning their focuses to producing vapor chambers (VCs) for HPC and high-end notebook products,...
Thursday 2 June 2022
ASE intros VIPack advanced packaging solutions
Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...
Wednesday 1 June 2022
HPC chip vendors favor 'on substrate' packaging for system integration
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Wednesday 1 June 2022
Arm-based HPC chips gain ground for PCs, benefiting OSATs
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
Tuesday 31 May 2022
High-end IC testing demand to stay robust in 2H22
Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...
Tuesday 31 May 2022
Diode, MCU suppliers ramping up for high-speed transmission, HPC, automotive applications
Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and...
Tuesday 31 May 2022
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms' and Google's potential capex cuts,...
Thursday 26 May 2022
Concerns rising over potential foundry overcapacity in 2024
Despite chip demand showing signs of a downturn since the start of 2022, the capacity expansion spree at foundry houses seems unstoppable, sparking concerns that overcapacity may...
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Tuesday 24 May 2022
Metaverse, ESG in spotlight at Computex 2022
Computex 2022 has kicked off in Taipei, with the focus this year on the metaverse, ESG (environmental, social, and governance), high-performance computing (HPC), AI, and 5G-related...
Tuesday 24 May 2022
TSMC poised to sustain lead with integrated advanced processes in next decade
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
Friday 20 May 2022
IC test solutions providers see orders for HPC chips boom
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
Friday 20 May 2022
TSMC to move CoWoS-L technology to commercial production in 2 years
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
Wednesday 11 May 2022
Intel Vision 2022 reveals on-demand service in cloud-to-edge infrastructure
On the first day of the Intel Vision 2022 event on May 10, Intel revealed an early look at the "Intel On Demand service," offering to help enterprises meet the needs...
Wednesday 4 May 2022
CHPT lands MEMS probe card orders from Asia-based customers
IC test interface solutions provider Chunghwa Precision Test Tech (CHPT) has newly landed MEMS probe card orders for smartphone chips from Asia-based customers, with volume production...