中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Anthropic's IPO spotlight falls on its potential US$750 billion AI compute tab
    15min ago
    Murata develops world's smallest NTC thermistor, targets 2027 mass production
    16min ago
    NEWS TAGGED HPC
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

    As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement...

    Friday 11 September 2026
    Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
    Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
    Monday 7 September 2026
    Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market
    Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...
    Sunday 6 September 2026
    Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027
    AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...
    Sunday 6 September 2026
    Trumpf CTO says advanced packaging reshapes semiconductor equipment race
    AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
    Friday 4 September 2026
    Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027
    Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow...
    Thursday 3 September 2026
    CHPT spans wafer to system-level testing
    Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    Innolux targets advanced packaging with debut of Chip Last tech
    Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers

    As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....

    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

    Wednesday 2 September 2026
    SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026

    At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading...

    Monday 31 August 2026
    Gudeng sees double-digit advanced packaging growth from 2027
    Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
    2/59 pages
    API
    BIZ FOCUS
    Oct 21, 08:00
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
    Tuesday 20 October 2026
    CES 2027 Welcomes First-Ever Chilean Global Pavilion