STMicroelectronics (STM) is partnering with Amazon Web Services (AWS) to develop a data center photonic chip that delivers 800Gbps and 1.6Tbps optical interconnect speeds for AI and...
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response,...
Cable and connector maker BizLink expects steady demand for high-performance computing (HPC) and semiconductor production equipment (SPE) to drive growth in 2025, with chairman Roger...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Chinese AI company DeepSeek has initiated a major recruitment drive for semiconductor design talent, signaling potential plans to develop its proprietary processors, according to...
Taiwan's export growth maintained its momentum in January 2025, driven primarily by artificial intelligence (AI) and high-performance computing (HPC) demand, according to statistics...
Chunghwa Precision Test Tech (CHPT), an IC test interface solutions provider, is poised to achieve its strongest-ever first quarter in 2025, propelled by robust orders for HPC chip...
The US intends to sustain its dominance in artificial intelligence (AI), and the market for HPC chips is expected to increase significantly for another four years, according to sources...
The demand for backend testing interfaces has surged due to advancements in semiconductor processes, leading CHPT to achieve record-high revenues in the fourth quarter of 2024. Notably,...
The semiconductor testing equipment market is experiencing unprecedented demand, particularly in artificial intelligence (AI) and high-performance computing (HPC) segments. Advantest...
According to a report by Mizuho, shipments of the GB200 NVL are on track to meet the late 2024 schedule, even though production volumes have initially been lower due to bottlenecks...
AI and high-performance computing (HPC) are pushing Qualcomm and AMD to escalate their challenge against Intel's decades-long dominance. Through technological innovation and focused...
Nan Ya PCB, one of Taiwan's top trio of substrate manufacturers, has capitalized on a strategic opportunity in the latter half of 2024 by launching new high-end substrate products...
With the rapid growth of AI, high-performance computing (HPC), and cloud computing, data centers face increasing challenges regarding performance demands, deployment flexibility,...
