While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
IC test solutions providers including Chunghwa Precision Test Tech (CHPT), MPI and WinWay Technology have seen a strong influx of probe card and final-test socket orders for HPC processors,...
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...
On the first day of the Intel Vision 2022 event on May 10, Intel revealed an early look at the "Intel On Demandservice," offering to help enterprises meet the needs...
IC test interface solutions provider Chunghwa Precision Test Tech (CHPT) has newly landed MEMS probe card orders for smartphone chips from Asia-based customers, with volume production...
High-performance computing technology has been widely adopted in advanced countries to facilitate technological innovation, commercial big-data analytics, and aerospace missions....
Taiwan-based OSAT ASE Technology expects demand for automotive, HPC and network ICs to stay robust and buoy further its sales performance in the second quarter and the second half...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Demand for HPC chip analysis and inspection remains robust in the second quarter of 2022, according to industry sources in Taiwan, where major pure-play foundries and OSATs operate...
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
Poor 3nm GAA process yield performance is deemed as a major setback for Samsung Electronics in its advanced foundry technology race with TSMC, which may dash the Korean tech giant's...
Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
TSMC is expected to see revenue generated from the HPC sector contribute more than NT$700 billion (US$23.9 billion) to the pure-play foundry's total revenue this year, according to...
TSMC is on track to move 3nm process technology to volume production in the second half of this year, according to company CEO CC Wei, who also reiterated the foundry's plans to launch...
