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    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    Aug 26, 19:17
    NEWS TAGGED SK HYNIX
    Thursday 27 August 2026
    SK Hynix questions PIM as thermal, packaging limits constrain HBM
    South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
    Thursday 27 August 2026
    CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
    CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
    Thursday 27 August 2026
    Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

    Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
    On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
    Tuesday 25 August 2026
    Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

    Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    Analysis: SK Hynix pushes beyond HBM with HBF and CPO
    SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
    Monday 24 August 2026
    Podcast highlights: TSMC Arizona's profit turnaround, US manufacturing viability pressures South Korean memory makers
    DIGITIMES analyst Luke Lin noted on a recent podcast that when reviewing TSMC's semiannual and first-quarter 2026 financial reports, the operational health and profitability of its...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Saturday 22 August 2026
    AI memory windfall: Samsung to hand back up to US$79 billion in 2026
    Samsung Electronics' board has approved a 2026 shareholder return plan estimated at KRW90 trillion to KRW110 trillion (approx. US$64-79 billion), which the company says is the largest...
    Friday 21 August 2026
    SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
    SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
    Friday 21 August 2026
    SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
    SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
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    GlobalExhibition
    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
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