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NEWS TAGGED IBIDEN
Monday 1 November 2021
Demand for large-area ABF substrates rises fast for HPC chips
As chipmakers continue to ramp up production of large-size HPC chips to meet the ever-rising requirements for computing power, IC substrate makers are all stepping up capacity expansion...
Friday 8 October 2021
Samsung reportedly to build additional ABF substrate capacity
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Thursday 23 September 2021
Nan Ya to scale up ABF substrate output for AMD processors
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which...
Thursday 23 September 2021
ABF substrate supply to remain constrained in 2022
Due to spec upgrades of new processors and growing difficulty in producing high-end ABF substrates with satisfactory yield rates, the world's actual ABF substrate supply growth could...
Friday 23 July 2021
ABF substrate supply may stay short of demand through 2023
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Monday 19 July 2021
ABF substrate prices poised to rise further in 2H21
ABF substrate prices are likely to rise quarter by quarter in the second half of the year, as demand for such substrates continues to outgrow new capacity supply, according to industry...
Monday 28 June 2021
Intel, AMD, Nvidia in keen competition for ABF substrate capacity
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Thursday 3 June 2021
AT&S to set up ABF substrate production base in Southeast Asia
AT&S has disclosed plans to invest EUR1.7 billion (US$2.07 billion) to set up a new production base for ABF substrates in Southeast Asia to satisfy the needs of its major HPC...
Tuesday 25 May 2021
IC substrate supply to stay constrained in 2021-2022
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Monday 3 May 2021
Taiwan IC substrate suppliers negotiating new deals with AMD
Major Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are negotiating with AMD a new form of supply deals under which the suppliers...
Thursday 29 April 2021
Ibiden to expand high-end ABF substrate capacity
Ibiden has announced plans to inject JPY180 billion (US$1.66 billion) into the expansion of production capacity for high-end IC substrates for applications such as servers and image...
Tuesday 6 April 2021
PTI lands major SMT testing orders for Intel CPUs
Taiwan-based Powertech Technology (PTI), a packaging partner for Intel's NAND flash chips, has newly landed backend SMT testing orders for CPUs from the chipmaker, and will see the...
Friday 26 March 2021
Semiconductor suppliers prepare for Intel Whitley
Suppliers of semiconductor components and materials, such as CCL and PCBs, have all geared up for the upcoming release of Intel's Whitley next-generation server CPU platform.
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Monday 8 March 2021
Tight ABF substrate supply may ease in 2023 at earliest
Tight supply for ABF substrates may ease in 2023 at the earliest if makers in Taiwan, Japan and Korea can smoothly commercialize their new capacity with stable yield rates in 2022...