Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 to March 2025). Similarly, another IC substrate company,...
The Japanese yen's depreciation will provide Japan-based ABF substrate companies with an additional advantage over their Taiwanese counterparts, in addition to technology leadership,...
Ibiden, a Japan-based IC substrate manufacturer, has highlighted a slower-than-anticipated rebound in the global demand for IC substrates. Despite this, there's a glimmer of hope...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Amid the generative AI boom, manufacturers related to AI semiconductors are all expected to benefit from this trend and thus have received much attention from the market. Japan's...
Japanese companies have moved to transfer their supply chains away from China and establish new subsidiaries and plants in other regions after the Economic Security Promotion Act...
Taiwan's top PCB supplier Zhen Ding Technology will focus more on high-end IC substrates, particularly ABF substrates, to bolster its future revenue growth amid persistently strong...
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
As chipmakers continue to ramp up production of large-size HPC chips to meet the ever-rising requirements for computing power, IC substrate makers are all stepping up capacity expansion...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Nan Ya PCB is set to commercialize new ABF substrate capacity by the end of 2021 and will scale up its output substantially for AMD's processors in the second quarter of 2022, which...
