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Monday 3 November 2025
Taiwan manufacturing set to gain as traditional and electronics sectors strengthen
The recent meeting between US President Donald Trump and his Chinese counterpart Xi Jinping has eased tensions between the two countries, de-escalating rare earth export controls...
Monday 3 November 2025
TSMC unveils four-year price hike for advanced chips starting 2026
Industry sources revealed TSMC had introduced a rare multi-year price increase strategy for its advanced semiconductor processes, effective starting in 2026. The company will implement...
Monday 3 November 2025
Nexperia's supply freeze upends global chip chains, but opens doors for Taiwan

The aftershocks of Nexperia's abrupt suspension of power semiconductor shipments continue to reverberate across the global electronics...

Monday 3 November 2025
Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam
Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.
Monday 3 November 2025
Tong Hsing Electronics eyes growth engines to revive 2026 operations
Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...
Monday 3 November 2025
Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier
Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...
Monday 3 November 2025
Samsung’s 2nm Tesla gamble: a long shot or a long-awaited comeback?
Samsung Electronics' foundry division appears poised for a long-anticipated recovery after winning consecutive chip orders from Tesla. Following reports that Samsung would handle...
Monday 3 November 2025
AI chip packaging complexity drives surge in equipment orders
TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...
Monday 3 November 2025
Win Semiconductor back in the black on US smartphone, 3D sensor demand

Win Semiconductor, the world's largest pure-play gallium arsenide (GaAs) foundry, rebounded sharply in the third quarter of 2025 on strong...

Sunday 2 November 2025
Samsung's Exynos 2600 chips challenge Apple and Qualcomm in early benchmarks
Samsung Electronics' next-generation application processor, the Exynos 2600, appears poised to reclaim the spotlight in the high-end smartphone chip market, with early benchmark tests...
Sunday 2 November 2025
Nvidia strengthens South Korea ties, turning AI drive into geopolitical strategy
As world leaders gather for the APEC Summit in Gyeongju amid tense geopolitics, South Korea is quietly taking on a new strategic role in the global AI race. Nvidia CEO Jensen Huang's...
Saturday 1 November 2025
Siemens turns to software to manage AI’s power surge
The rapid expansion of the semiconductor industry and artificial intelligence (AI) supply chains is driving a sharp increase in global electricity demand, raising new challenges for...
Saturday 1 November 2025
LandMark eyes strong SiPh growth with rising long-term orders
LandMark expects its silicon photonics (SiPh) product shipments to continue increasing over the next few quarters, with fourth quarter 2025 revenue projected to match or slightly...
Saturday 1 November 2025
China’s rare earth squeeze reaches a turning point in the global tech standoff
Rare earth elements (REEs), comprising 17 chemical elements including the 15 lanthanides from lanthanum (La, atomic number 57) to lutetium (Lu, 71), plus scandium and yttrium, are...
Saturday 1 November 2025
Nvidia emerges as TSMC's first A16 customer, while Apple may skip to A14
Taiwan Semiconductor Manufacturing Company (TSMC) plans to launch its latest 1.6nm process, dubbed A16, in 2027. Reports indicate that Nvidia is currently working with TSMC on testing...