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    China’s 15th five-year plan elevates PCB role in AI supply chains
    Oct 5, 18:10
    Huawei’s Kirin 9050 Pro reveals new logic folding chip design
    Oct 5, 18:10
    Huawei says 381 tau chips are already in mass production
    Oct 5, 18:10
    Samsung accelerates HBM thermal management push as AI packaging scales up
    Oct 5, 18:10
    South Korean PCB exports ride AI demand, set to surpass 2022 peak in 2026
    Oct 5, 18:10
    NEWS TAGGED INTEL
    Wednesday 16 September 2026
    Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
    Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
    Wednesday 16 September 2026
    Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

    The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

    Monday 14 September 2026
    Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
    AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
    Friday 11 September 2026
    Altera eyes $2B IPO, from Intel carve-out to public debut
    Chipmaker Altera is laying the groundwork for an initial public offering (IPO) that could raise over US$2 billion as early as late 2026. According to sources familiar with the matter...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Tuesday 8 September 2026
    Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps
    Intel's PC CPU prices have continued to rise since the end of 2025, and supply chain sources said the company is expected to raise them by another 10%. Its low-margin small-core line...
    Friday 4 September 2026
    Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff
    The mechanics of Nvidia's US$12.93 billion purchase of Hugging Face say as much about the deal's purpose as the strategic case does: a tenth of the consideration is set aside to stop...
    Thursday 3 September 2026
    Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
    Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
    Wednesday 2 September 2026
    Taiwan doesn't just want a quantum lab — it wants a quantum fab
    Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...
    Tuesday 1 September 2026
    XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
    South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Monday 31 August 2026
    Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
    Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
    Thursday 27 August 2026
    Google, MediaTek embrace advanced packaging diversification
    Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
    Wednesday 26 August 2026
    Hot Chips 2026: Nvidia pushes deeper into server CPUs with Vera
    Nvidia used Hot Chips 2026 to disclose more details about Vera, its next-generation data-center CPU, as the company pushes deeper into the standalone server processor market long dominated...
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    BIZ FOCUS
    Oct 5, 08:00
    AI Family Digital Twins Bridge Elder Care Gaps
    Friday 2 October 2026
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting