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Friday 2 January 2026
Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...
Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Friday 2 January 2026
South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies
South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces...
Friday 2 January 2026
Samsung raises 2025 bonuses for DS division amid memory boom
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM).
Thursday 1 January 2026
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors,...

Wednesday 31 December 2025
Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial...

Wednesday 31 December 2025
Samsung reportedly plans 50% HBM output surge through 2026

Samsung Electronics plans to boost its high-bandwidth memory (HBM) production capacity by approximately 50% through late 2026, according...

Wednesday 31 December 2025
TSMC reportedly speeds up Arizona 3nm fab plans as Samsung woos US clients in Texas

According to South Korean media reports and industry sources, TSMC is moving to pull forward the production schedule at its second Arizona...

Wednesday 31 December 2025
South Korean PCB industry faces cost challenges as AI drives raw material prices up
The South Korean printed circuit board (PCB) industry is struggling as soaring gold and copper prices, up 50% and 30% respectively since early 2025, increase production costs. Despite...
Wednesday 31 December 2025
Samsung faces scrutiny over Taiwan probe, denies memory market ties
Samsung Electronics has expanded an internal investigation into alleged employee misconduct at its Taiwan subsidiary, a move the company characterizes as an isolated matter despite...
Tuesday 30 December 2025
South Korea charts road to 0.2nm chips by 2040
The global semiconductor industry is poised to enter the "angstrom era" by 2040 as circuit dimensions shrink to one-tenth of current levels, according to a long-term technology roadmap...
Tuesday 30 December 2025
US reportedly eases chip tool curbs for Samsung, SK Hynix China plants

The US has reportedly adjusted export control procedures for Samsung Electronics and SK Hynix operations in China, easing near term operational...

Tuesday 30 December 2025
SMIC acquires remaining stake in wafer unit for US$5.8 billion
Semiconductor Manufacturing International Corp. (SMIC), China's largest contract chipmaker, said on Monday it will take full control of its SMNC wafer manufacturing unit in a transaction...
Monday 29 December 2025
SK Hynix weighs US expansion for advanced chip packaging
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that...
Monday 29 December 2025
South Korea expected to reclaim no. 2 in global chip equipment spending by 2026

South Korea is on track to significantly increase semiconductor equipment investment in 2026 as rising demand for high-bandwidth memory...