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NEWS TAGGED LINGSEN
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Friday 6 August 2021
OSATs, power chips makers gain shifted orders from ASEAN
Shortages of automotive MOSFET and power management ICs are getting worse as many IDMs including Infinenon and On-Semi are operating at reduced capacity at their plants in Malaysia,...
Friday 23 July 2021
Wire-bonding quotes to hike again in 1H22 as materials costs surge
OSATs are expected to raise their quotes again for wire-bonding packaging services in the first half of 2022 to reflect ever-rising costs for materials such as leadframes and molding...
Tuesday 13 July 2021
Taiwan 2nd-tier OSATs to embrace bright prospects for 2H21
Taiwan's second-tier IC backend houses are set to embrace brisker business results for the second half of the year thanks to a significant surge in customer orders, after posting...
Wednesday 9 June 2021
OSATs to log full wire-bonding capacity utilization throughout 2021
Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...
Friday 21 May 2021
Pandemic-driven demand buoying chip suppliers in 2021 and beyond
The ongoing coronavirus-induced stay-at-home activities have continued to spur demand for semiconductor and IC parts in 2021, buoying sales at many Taiwan-based chipmakers, including...
Thursday 20 May 2021
Backend houses see strong demand for display peripheral ICs
Backend demand for display peripheral ICs, such as T-Con and TDDI chips, has been robust, and major OSATs such as ASE Technology and Greatek Electronics are busy processing such chips...
Friday 7 May 2021
Longer production lead times to constrain revenue growth at MCU vendors
Taiwan's MCU vendors will see their revenue growth momentum constrained in the short term by extended delivery lead times at foundry and backend houses, although they have abundant...
Wednesday 28 April 2021
OST scaling up IR MEMS sensor shipments for gaming notebooks
Taiwan-based Oriental System Technology (OST) is expected to scale up its shipments of infrared (IR) MEMS sensors for gaming notebooks to 4.5 million units in 2021 from 2.8 million...
Monday 19 April 2021
Capacity utilization, expansion for mature processes now top concern for OSATs
Taiwan's backend houses are relatively conservative about capex expansions, compared to foundry houses and fabless firms' eagerness in inceasing spending, according to industry sou...
Thursday 8 April 2021
Backend firms see persistently strong demand for MCUs
Backend firms including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE) continue to enjoy strong packaging demand for...
Wednesday 24 March 2021
Wire-bonding capacity to sustain full utilization throughout 2021
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Tuesday 22 December 2020
Taiwan OSAT firms see clear order visibility through mid-2021
Taiwan-based OSAT services providers have seen clear order visibility through mid-2021, thanks to robust demand for 5G and Wi-Fi chips, power management ICs (PMIC), and display driver...