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    Taiwan's Chun Yuan Steel sees 4Q26 auto surge, expands into AI robotics
    2min ago
    Charts: YMTC bets on premium eSSDs to take on Samsung
    12min ago
    China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains
    21min ago
    AIDC white paper flags energy efficiency, power management as key to site selection
    25min ago
    Japan bets on physical AI as Murata, AWS, Hitachi showcase self-learning robots at CEATEC 2026
    37min ago
    Nvidia expands China gaming partnerships
    Oct 15, 18:46
    Commentary: The methodology behind Lip-Bu Tan’s strategy of vulnerability for Intel
    Oct 15, 18:46
    Analysis: GF finds high-value outlet for mature capacity through advanced packaging, lessons for China
    Oct 15, 18:46
    NEWS TAGGED MALAYSIA
    Friday 16 October 2026
    DayOne doubles Johor data center financing to MYR30 billion as billings pass 1GW
    Singapore-based data center developer DayOne has secured an additional MYR15 billion (US$3.67 billion) in financing from a consortium of seven banks to expand hyperscale data center...
    Friday 16 October 2026
    Samsung SDI targets 2027 LFP BBU battery production
    Samsung SDI will begin mass-producing cylindrical lithium iron phosphate (LFP) batteries for AI servers as early as June 2027, marking the first adoption of cylindrical LFP backup...
    Tuesday 13 October 2026
    Malaysian states team up to back homegrown chip firms
    The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
    Monday 12 October 2026
    Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang
    PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
    Saturday 10 October 2026
    Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
    Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
    Thursday 8 October 2026
    Malaysia's chip push: a new island and pressure from Washington and Beijing
    Malaysia's plan to climb the semiconductor value chain is colliding with two constraints: a shortage of land in Penang, the heart of its chip industry, and mounting pressure to pick...
    Wednesday 7 October 2026
    Rapidus adds Malaysian chip designers to its semiconductor network
    Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...
    Thursday 1 October 2026
    Infineon opens new backend chip plant in Thailand, eyes growth to up to five modules
    Infineon Technologies officially inaugurated a new backend manufacturing site in Samut Prakan, south of Bangkok, on October 1, expanding the German chipmaker's production network in...
    Monday 28 September 2026
    South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations

    South Korea's exports of the customs category that carries high-bandwidth memory (HBM) are no longer a two-destination story. Unit-value...

    Thursday 24 September 2026
    Yusin Malaysia plant to fully ramp up by 4Q26

    Brake system parts maker Yusin said at an investor conference on September 23 that key equipment at its new Malaysia plant is expected...

    Wednesday 23 September 2026
    Malaysia reviews data centre benefits after 40-plus 2026 applications
    Malaysia has received more than 40 applications to develop or expand data centres so far in 2026, underscoring the region's continued boom in data centre investment. But officials...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Thursday 10 September 2026
    Firmus, OpenAI strike compute deal for Malaysia AI factories
    Firmus and OpenAI have announced a multi-year strategic partnership that will add dedicated AI compute capacity in Malaysia, underscoring how Asia-Pacific is becoming central to global...
    Wednesday 9 September 2026
    CSPs expand Malaysia AI server hubs as Southeast Asia grows
    According to the latest DIGITIMES Intelligence report, US-based cloud service providers (CSPs) are expanding their footprint in Malaysia, with Microsoft and Google driving the next...
    Wednesday 9 September 2026
    OpenAI taps Firmus for Malaysia data center capacity
    OpenAI has signed a multi-year agreement with Australian AI infrastructure developer Firmus for dedicated computing capacity at two data center sites in Malaysia, becoming an anchor...
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    GlobalExhibition
    BIZ FOCUS
    Oct 15, 08:00
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
    Wednesday 14 October 2026
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
    Wednesday 14 October 2026
    Practical Insights & Industry Ideas
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored